Optimization of routing layers and board space requirements for a ball grid array land pattern

ABSTRACT

A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array land pattern is described. The land pattern includes a plurality of conductive pads arranged in an array of rows and columns. The array of pads has at least one edge of a perimeter of the array not fully populated with conductive pads, whereby spaces are created in the at least one edge by the missing conductive pads. The spaces create additional routing channels for signals from conductive pads within the array to be routed externally to the array through the at least one edge.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.10/651,164, filed Aug. 29, 2003 U.S. Pat. No. 6,916,995, which claimsthe benefit of U.S. Provisional Application No. 60/449,562, filed Feb.25, 2003, all of which are herein incorporated by reference in theirentirety.

The following application of common assignee is related to the presentapplication, has the same filing date as the present application, and isherein incorporated by reference in its entirety:

“Optimization of Routing Layers And Board Space Requirements For BallGrid Array Package Implementations Including Array CornerConsiderations,” Ser. No. 10/650,975.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to integrated circuit packaging, and moreparticularly, to improved routing in integrated circuit packages and incircuit boards to which they are mounted.

2. Background Art

Integrated circuit (IC) dies are typically mounted in or on a packagethat is attached to a printed circuit board (PCB). One such type of ICdie package is a ball grid array (BGA) package. BGA packages provide forsmaller footprints than many other package solutions available today. ABGA package has an array of solder ball pads located on a bottomexternal surface of a package substrate. Solder balls are attached tothe solder ball pads. The solder balls are reflowed to attach thepackage to the PCB. The IC die is mounted to a top surface of thepackage substrate. Wire bonds typically couple signals of the IC die tothe substrate. The substrate has internal routing which electricallycouples the IC die signals to the solder balls on the bottom substratesurface.

BGA packages are widely used in the IC packaging industry. BGA packageshave many beneficial characteristics, including high reliability, arelatively mature assembly process, relatively low cost, and goodthermal and electrical performances. Existing BGA packages, however,have limitations that affect their ability to be used for advanced ICdie applications.

Increasingly more functions are being integrated into individual ICdies. Thus, BGA package substrates must interface a greater number ofinput/output (I/O) signals, and powers and grounds, with the PCB. Thus,signal routing in both the package substrate and PCB is becoming morecomplex. Hence, to accommodate these difficulties, increasingly largerBGA package sizes are being used, with larger arrays of solder ballpads. Furthermore, the number of layers of the package substrate isincreasing. However, these changes have undesirable consequences,including an increase in the cost of the BGA package, and a larger BGApackage footprint on the PCB.

Hence, what is needed are BGA packages that can accommodate increasinglylarger IC dies, while maintaining or reducing the overall BGA packagesize. Furthermore, what is needed are techniques for reducing thecomplexity of BGA package and related PCB signal routing.

BRIEF SUMMARY OF THE INVENTION

The present invention provides a method and apparatus for improvingsignal routing of integrated circuit (IC) packages and printed circuitboards (PCBs). The present invention further provides improved contactpad arrays for IC packages, and improved land patterns for attaching theIC packages. The land patterns and arrays are formed with edge rows thatare not fully populated with contact pads. Spaces in the non-fullypopulated edge rows allow for additional signal routing channels, whicheases IC package and PCB design and manufacturing and improvesperformance.

In an aspect of the present invention, an IC package includes asubstrate material having a first side configured to receive asemiconductor chip. A second side of the substrate has a plurality ofcontact or conductive pads arranged in an array of rows and columns. Oneor more edges of the array are not fully populated with pads.

In another aspect, a land pattern for interfacing an IC package includesa plurality of contact or conductive pads arranged in an array of rowsand columns. One or more edges of a perimeter of the array is not fullypopulated with conductive pads. Spaces created in the edges by missingconductive pads create additional routing channels for signals fromconductive pads within the array to be routed external to the arraythrough the edges.

In another aspect, a PCB includes a substrate material and a pluralityof conductive features on a first side of the PCB. The conductivefeatures include a plurality of contact or conductive pads arranged inan array of rows and columns. The array of conductive pads is configuredto receive mounting thereon of an integrated circuit device. One or moreedges of a perimeter of the array is not fully populated with conductivepads. Spaces created in the edges by missing conductive pads createadditional routing channels for signals from conductive pads within thearray to be routed external to the array through the edges.

According to aspects of the present invention, any number of one or moreof the spaces are created in any number of one or more edges to createthe additional routing channels.

In an aspect of the invention, a number of spaces to be formed in anedge (i.e., the number of spaces not occupied by a conductive pad) isoptimized, such that little or no benefit in signal routing capacitywill be gained by adding further spaces to an edge, and that signalrouting capacity may be reduced by removing spaces. For example, in anexample aspect of the invention, an optimized number of spaces iscalculated according toS=INT((E−5)/3),where:

S=the number of spaces to be formed in the edge;

E=a number of conductive pads in the edge, if fully populated; and

INT is an INTEGER function, rounded down.

In one aspect of the invention, a ratio of conductive pads in an edge toa number of spaces in the edge is at least 2 to 1.

Furthermore, the present invention describes a method and system fordesigning a land pattern for mating an IC package/device to a PCB. Anumber of required pins is determined. An array pattern is selected toyield the required pins. A number of required perimeter routing channelsis determined. A size of the array is optimized to yield the requiredperimeter routing channels. At least one perimeter edge of the array isunder-populated.

In an aspect, a perimeter edge of the array is under-populated by addingat least one non-fully populated perimeter edge of pins to the array.

In an alternative aspect, a perimeter edge of the array isunder-populated by removing pins from at least one existing fullypopulated perimeter edge of the array.

In another aspect of the present invention, a method and apparatus for aland pattern in a multi-layer printed circuit board is described. Afirst layer of the circuit board comprises a substrate material. Aplurality of conductive features are formed on a surface of the firstlayer. The conductive features include a first plurality of conductivepads arranged in a first array of rows and columns that are configuredto receive mounting thereon of an integrated circuit device. A secondlayer of the circuit board comprises a substrate material. A secondplurality of conductive pads are arranged in a second array of rows andcolumns on a surface of the second layer. The second array includesfewer rows and columns than the first array. A plurality of conductivevias through the circuit board electrically couple at least a portion ofthe first plurality of conductive pads to corresponding conductive padsof the second plurality of conductive pads. At least one edge of aperimeter of the first array is not fully populated with conductivepads. Spaces created in the edge by missing conductive pads createadditional routing channels for signals from conductive pads within thefirst array to be routed external to the first array through the edge.

In another aspect, additionally or alternatively, spaces can be createdin at least one edge of the second array on the second layer to createadditional routing channels for signals from conductive pads within thesecond array to be routed external to the second array through the edge.

In another aspect, the multi-layer circuit board can have furtherlayers. The further layers can have additional pluralities of conductivepads arranged in arrays that are coupled by vias through the circuitboard to the first array. These additional arrays can have spaces inedges to create additional routing channels for signals from conductivepads within the arrays to be routed external to the respective array.

In another aspect of the present invention, a method and system fordesigning a land pattern for mating an integrated circuit device to aprinted circuit board is described. A number of required pads isdetermined. A number of layers of the printed circuit board to haverouting channels is determined. A land pattern is selected to yield therequired pads. A number of required perimeter routing channels isdetermined for an array of conductive pads on each layer of thedetermined number of layers. A size of the land pattern is optimized toyield the required perimeter routing channels in each layer. A least oneperimeter edge on at least one layer is under populated with conductivepads.

In still another aspect of the present invention, a system and methodfor designing a land pattern for mating an integrated circuit device toa printed circuit board is described. A number of required pads isdetermined. A number of required perimeter routing channels isdetermined. A land pattern is selected to yield the required number ofpads and number of required perimeter routing channels. The selectedland pattern incorporates one or more corner pad arrangements. A cornerpad arrangement includes pads of two edges that converge at a corner ofthe land pattern. A corner pad arrangement has one or more knowncharacteristics, such as a number of lost or unusable routing channels.This number can be used to aid in determining an overall routing channelcapacity for a land pattern incorporating the corner pad arrangement.

In a further aspect, a land pattern that yields the required number ofpads and number of required perimeter routing channels is selectedaccording to the following: A potential land pattern that at leastyields the required pads is selected. A pad arrangement is selected forat least one corner portion of the selected potential land pattern. Atleast one perimeter edge of the selected potential land pattern is underpopulated. It is then determined whether the selected potential landpattern yields at least the determined number of required perimeterrouting channels.

In an aspect, this process for selecting the land pattern can berepeated for subsequent potential land patterns if the first potentialland pattern is inadequate in terms of routing channels, for comparisonpurposes, or for other reasons.

The foregoing and other features and advantages of the invention will beapparent from the following more particular description of theembodiments of the invention, as illustrated in the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

The accompanying drawings which are incorporated therein and form a partof the specification illustrate the present invention and together withthe description further serves to explain the principles of theinvention and to enable a person skilled in the art to make and use theinvention.

FIG. 1 illustrates an example ball grid array package.

FIG. 2 illustrates an example array of solder ball pads, fullypopulated.

FIG. 3 shows an example subset of a conventional, fully populated,solder ball pad array having nine solder ball pads, with correspondingsignal routing.

FIG. 4 shows a subset of a non-fully populated solder ball pad arrayhaving nine solder ball pads, and corresponding signal routing,according to an example embodiment of the present invention.

FIG. 5A shows an example conductive pad pattern.

FIG. 5B shows the conductive pad pattern of FIG. 5A with conductive padsremoved from a periphery, according to an example embodiment of thepresent invention.

FIG. 5C shows a portion of the conductive pad pattern of FIG. 5B.

FIG. 5D shows a land pattern with example signal routing, according toan embodiment of the present invention.

FIGS. 6A and 6B show a table providing optimized land pattern and arrayinformation, according to embodiments of the present invention.

FIG. 7A shows a conductive pad pattern, which is similar to the patternshown in FIG. 5A, with an additional perimeter of conductive pads addedthereto.

FIG. 7B shows the conductive pad pattern of FIG. 7A, with the additionalperimeter edges not fully populated with pads, according to anembodiment of the present invention.

FIG. 8 shows a flowchart providing steps for designing a land pattern orarray, according to an example embodiment of the present invention.

FIG. 9 shows a table providing various dimensions for a variety ofconductive pad arrays that are applicable to the present invention.

FIGS. 10–15 show various layers in an example multi-layer embodiment ofthe present invention.

FIG. 16 shows a pad/pin layout for the example multi-layer embodiment ofFIGS. 10–15, according to an embodiment of the present invention.

FIG. 17A shows an example conventional solder ball pad and routingarrangement.

FIG. 17B shows an example solder ball pad and routing arrangement,according to an embodiment of the present invention.

FIG. 17C shows an edge portion of a land pattern/array with aconventional edge pad arrangement and routing.

FIG. 17D shows an edge portion of a land pattern/array that incorporatesa series arrangement of sets that include pads/pins and spaces, toprovide additional routing channels, according to embodiments of thepresent invention

FIGS. 18–32 show example corner pad arrangements for land patterns,according to embodiments of the present invention.

FIG. 33 shows a table providing data related to the corner padarrangements of FIGS. 18–32, according to an example embodiment of thepresent invention.

FIG. 34 shows a flowchart for designing land patterns, according toembodiments of the present invention.

FIG. 35 shows a flowchart for selecting a land pattern, according toembodiments of the present invention.

FIG. 36 shows a portion of a land pattern that incorporates corner padarrangements, according to an example embodiment of the presentinvention.

FIG. 37 shows a table providing corner arrangement and routing channeldata for an example set of land patterns, according to an embodiment ofthe present invention.

FIGS. 38–42 show portions of land patterns that incorporate corner padarrangements, according to example embodiments of the present invention.

FIGS. 43A and 43B show a table similar to the table shown in FIGS. 6Aand 6B, modified to account for corner pad arrangements in arrays/landpatterns, according to an embodiment of the present invention.

FIGS. 44A–44C show layers of a printed circuit board having routingchannels on multiple layers, according to an embodiment of the presentinvention.

FIG. 45 shows a table providing corner arrangement for an example set ofland patterns having particular required numbers of power channels,according to an embodiment of the present invention.

The present invention will now be described with reference to theaccompanying drawings. In the drawings alike reference numbers indicateidentical or functionally similar elements. Additionally, the left-mostdigits of a reference number identifies the drawing in which thereference number first appears.

DETAILED DESCRIPTION OF THE INVENTION

Overview

The present invention is directed to the optimization of routing layersand board space requirements in integrated circuit (IC) packages andprinted circuit boards (PCBs). For example, the present invention isapplicable in land grid array (LGA), pin grid array (PGA), chip scalepackage (CSP), ball grid array (BGA), and other integrated circuitpackage types, and their respective PCB land patterns. The presentinvention is applicable to all types of package substrates, includingceramic, plastic, and tape (flex) substrates. Furthermore the presentinvention is applicable to die-up (cavity-up) and die-down (cavity-down)IC die orientations. For illustrative purposes, the present invention isdescribed herein as being implemented in a BGA package. However, thepresent invention is applicable to the other integrated circuit packagetypes mentioned herein, and to additional integrated circuit packagetypes.

Note that the terms “contact pad,” “contact,” and “conductive pad” areused interchangeably herein to refer to an element that makes electricalcontact. Furthermore, although the description below primarily refers toIC packages having “pads” for making electrical contact, the presentinvention is also applicable to IC packages having “pins” or sockets formaking electrical contact.

Furthermore, as used herein, “array” refers to a group of combination ofconductive pads or pins on a surface of a PCB or substrate. For example,“array” is used to refer to a group or combination of conductive pads orpins of an IC package substrate, typically arranged in rows and columns,for interfacing with a PCB or other structure, when mounted thereto. Asused herein, “land pattern” refers to a type of array, primarilyreferring to a group or combination of conductive pads on a surface of aPCB or other structure, typically arranged in rows and columns, intendedfor the mounting of an IC package. A “land pattern” is also known as“footprint,” and these terms are used interchangeably herein.

Note that, for illustrative purposes, the present specification anddrawings sometimes refer to either land patterns or arrays. It is to beunderstood, however, that the description below related to formingnon-fully populated edges is fully applicable to both land patterns andarrays.

Ball grid array package types are described below. A discussion of thepresent invention is provided, and then various embodiments of thepresent invention are described. Initially, conceptual embodiments aredescribed that encompass the invention more generally, and can also beconsidered to be approximations. Description of these embodiments isfollowed by description of more specific embodiments relating to morecomplete implementations. Note that the embodiments described herein maybe combined in any applicable manner, as required by a particularapplication.

Ball Grid Array (BGA) Package

A ball grid array (BGA) package is used to package and interface an ICdie with a printed circuit board (PCB). BGA packages may be used withany type of IC die, and are particularly useful for high speed ICs. In aBGA package, solder pads do not just surround the package periphery, asin chip carrier type packages, but may cover the entire bottom packagesurface in an array configuration. BGA packages are also referred to aspad array carrier (PAC), pad array, land grid array, and pad-grid arraypackages. BGA package types are further described in the followingparagraphs. For additional description on BGA packages, refer to Lau, J.H., Ball Grid Array Technology, McGraw-Hill, N.Y., (1995), which isherein incorporated by reference in its entirety.

Die-up and die-down BGA package configurations exist. In die-up BGApackages, the IC die is mounted on a top surface of a substrate orstiffener, in a direction away from the PCB. In die-down BGA packages,the IC die is mounted on a bottom surface of the substrate or stiffener,in a direction towards the PCB.

A number of BGA package substrate types exist, including ceramic,plastic (PBGA), and tape (also known as “flex”). FIG. 1 illustrates aconventional flex BGA package 100. BGA package 100 includes an IC die102, a substrate 104, a plurality of solder balls 106, and one or morewire bonds 108.

Substrate 104 is generally made from one or more conductive layersbonded with a dielectric material. For instance, the dielectric materialmay be made from various substances, such as polyimide tape. Tape (or“flex”) substrates are particularly appropriate for large IC dies withlarge numbers of input and outputs, such as application specificintegrated circuits (ASIC) and microprocessors. The conductive layersare typically made from a metal, or combination of metals, such ascopper and/or aluminum. Trace or routing patterns are made in theconductive layer material. Substrate 104 may be a single-layer tape, atwo-layer tape, or additional layer tape substrate type. In a two-layertape, the metal layers sandwich the dielectric layer, such as in acopper-Upilex-copper arrangement. Substrate 104 may alternatively be aplastic, ceramic, or other substrate type.

IC die 102 is attached directly to substrate 104, for example, by anepoxy or other die-attach material. IC die 102 is any type ofsemiconductor integrated circuit, separated from a semiconductor wafer.

One or more wire bonds 108 connect corresponding bond pads 118 on IC die102 to contact pads 120 on substrate 104. Bond pads 118 are I/O pads forIC die 102 that make internal signals of IC die 102 externallyavailable. Note that alternatively, IC die 102 may be flipped andmounted to substrate 104 by solder balls located on the bottom surfaceof IC die 102, by a process commonly referred to as “C4” or “flip chip”packaging. In such an embodiment, wire bonds 108 are not required.

Encapsulating material 116 covers IC die 102 and wire bonds 108 formechanical and environmental protection. Encapsulating material 116 is amold compound, epoxy, or other applicable encapsulating substance.

As shown in FIG. 1, BGA package 100 does not include a stiffener. Insome BGA package types, particularly in tape or flex BGA packages, astiffener can be attached to the substrate to add planarity and rigidityto the package.

BGA package 100 includes an array of solder ball pads located on abottom external surface of substrate 104 for attachment of solder balls106. Wire bonds 108 are electrically connected to solder balls 106underneath substrate 104 through corresponding vias and routing insubstrate 104. The vias in substrate 104 can be plated or filled with aconductive material, such as solder, to allow for these connections.Solder balls 106 are used to attach BGA package 100 to the PCB.

FIG. 2 shows an example land pattern 200. Land pattern 200 is located ona surface 210, which may be a surface of a PCB (i.e., for attachment ofa BGA or other IC package), for example. In FIG. 2, land pattern 200 isshown as a 12×12 array of rows and columns of conductive pads 202.Conductive pads 202 may be solder ball contact pads, or other contact orconductive pad types. For illustrative purposes, land pattern 200 isshown as a 12×12 array of conductive pads 202. However, the presentinvention is applicable to arrays and land patterns of different sizes.

Land pattern 200 includes first, second, third, and fourth edge portions220 a, 220 b, 220 c, and 220 d, which are each indicated by a respectiverectangle in FIG. 2. As shown in FIG. 2, each edge portion 220 includesthe number of conductive pads 202 serially aligned along an entire edgeof land pattern 200, minus one corner conductive pad 202. Thus, the fouredges of land pattern 200 include twelve conductive pads 202, whilefirst, second, third, and fourth edge portions 220 a–220 d each includeeleven conductive pads 202 (i.e., 12−1=11).

FIG. 2 also shows portions of first and second electrically conductiverouting channels 204 a and 204 b on surface 210 (for illustrativepurposes, other routing channels on surface 210 are not shown). Firstand second routing channels 204 a and 204 b are routed through a spacebetween first and second conductive pads 202 a and 202 b. Due to thespacing of solder balls 202 in land pattern 200, and due to a particularrouting channel width, only two routing channels can be routed through agap between any two conductive pads 202, such as first and secondconductive pads 201 a and 202 b. Such an arrangement reduces costs andoptimizes manufacturing constraints relative to other spacing androuting channel arrangements. However, this arrangement causesdifficulties in routing a sufficient number of signals from conductivepads 202 within land pattern 200 to points on surface 210 outside ofland pattern 200.

For example, FIG. 3 shows an example land pattern portion 300 having aconventional arrangement of conductive pads 202. Land pattern portion300 includes nine conductive pads 202 a–202 i. For illustrativepurposes, conductive pad 202 f is shown as square-shaped. For thepurposes of the example of FIG. 3, it is desired to route signals fromeach of conductive pads 202 a–202 i to destinations to the right of landpattern portion 300, through land pattern portion 300. As describedabove, only two routing channels 204 are possible in a space between anytwo adjacent conductive pads 202. Thus, as shown in FIG. 3, routingchannels are possible only for seven of the nine conductive pads 202a–202 i. Routing channels 204 a–204 g correspond to conductive pads 202b–202 f, 202 h, and 202 i. Due to spacing constraints of land patternportion 300, conductive pads 202 a and 202 g are not able to be routedexternally from land pattern portion 300. As described below, thepresent invention allows for a greater number of routing channels 204than conventional land pattern portion 300.

Embodiments of the Present Invention for Improved Routing

Example embodiments for improving IC package-related signal routing areprovided below. These embodiments are provided for illustrativepurposes, and are not limiting. Alternative embodiments will be apparentto persons skilled in the relevant art(s) based on the discussioncontained herein. As will be appreciated by persons skilled in therelevant art(s), other array and land pattern configurations are withinthe scope and spirit of the present invention.

According an embodiment of the present invention, routing channelcapacity is improved by using land patterns and/or arrays having edgerows and/or columns that are not fully populated with conductive pads.Spaces in the edges are formed that create additional routing channelsso that more signals can be routed from the land pattern or array. Thissubsection relates to embodiments that tend to be moreconceptual/approximations, although in some embodiments, the embodimentsdescribed in this subsection can provide optimum/exact results. Forexample, for this subsection, the accuracy in numbers of routingchannels determined for a particular edge can have a range of +/−1routing channel, or even better results.

For example, FIG. 4 shows an example land pattern portion 400 havingconductive pads 202 arranged according to an embodiment of the presentinvention. As shown in FIG. 4, as compared to land pattern portion 300shown in FIG. 3, conductive pad 202 f has been replaced with an openingor space 402. A conductive pad 202 j has been added to the left side ofland pattern portion 400 for illustrative purposes. By forming space 402in the peripheral edge of land pattern portion 400, additional signalrouting channels are available. For example, in contrast to FIG. 3, asshown in FIG. 4, two additional routing channels 204 h and 204 i arepresent due to space 402. Thus, all nine conductive pads 202 a–202 e and202 g–202 j are able to be routed externally from land pattern portion400.

In the present embodiment (having, for example, a line width of 0.005″,a spacing of 0.005″, a pad width of 0.024″, and a ball or pad pitch of0.050″, or having other similar relative dimensions), a space 402 in anedge allows for two additional routing channels (i.e., in addition tothe routing channel coupled to the pad/pin that would otherwise occupyspace 402), for a total of three routing channels related to space 402.Note that in alternative embodiments having different routing channelwidths or spacings, a space 402 may instead allow for fewer or more thantwo additional routing channels 204.

The present invention has numerous advantages. For instance, the presentinvention allows a greater percentage of contact pads/pins to beaccessible by routing channels. The present invention further allows fora reduced overall IC package size. For example, the present inventionallows for a smaller IC package and/or PCB substrate surface area,and/or for fewer substrate layers. Hence, the present invention alsoreduces IC package and PCB costs.

Furthermore, the present invention reduces a time required to select pador pin assignments. Still further, the present invention offers anon-standard pad pitch that is practical for high-volume production.Furthermore, the present invention reduces a number of pads/pins thatare forced to be “orphaned” (i.e., cannot be externally routed fromwithin the land pattern or array on the same layer as other signals).Furthermore, the present invention allows a larger number of signals tobe routed on a single board layer. The present invention has numerousfurther advantages.

As described above, according to the present invention, conductive padpatterns are formed having one or more edges that are not fullypopulated with solder ball pads. The locations of openings or spaces 402in an edge of a solder ball pad pattern can be selected manually orautomatically, or by a combination thereof. For example, a layoutdesigner may manually select the placement of one or more openings orspaces 402 in an edge of a solder ball pad pattern. Alternatively, anautomated system may select the locations for the one or more openingsor spaces 402. The automated system may include hardware, software,firmware, or any combination thereof, to perform the present invention.

Furthermore, in an embodiment, a layout designer or automated system mayuse a library of land pattern and/or array subsections that includenon-fully populated edge portions to assist in creating board layouts.For example, land pattern portion 400 may be included in such a library.Therefore, land pattern portion 400 could be selected from the libraryfrom other land pattern portions to create a partial or complete landpattern. Further land pattern or array subsections for inclusion in alibrary will be apparent to persons skilled in the relevant art(s) fromthe teachings herein.

According to an embodiment of the present invention, routing channelcapacity is improved by removing one or more pads/pins from a perimeterside or edge of the land pattern or array. In an alternative embodiment,routing capacity is improved by adding a non-fully populated perimeterside or edge to a land pattern or array. These embodiments are fullydescribed in the sub-sections below.

Embodiments Improving Routing Capacity by Removing Pads

As described above, routing capacity may be increased by removing one ormore pins/pads from a peripheral edge of a land pattern or array. Inembodiments of the present invention, any number of pins/pads may beremoved from any number of edges of the land pattern or array.Furthermore, the pins/pads may be removed from any pin/pad location ofan edge.

In an embodiment, an edge of a land pattern or array can be viewed ashaving one or more “sets” of conductive pad positions. A set may includeany number of two or more adjacent conductive pad positions. An openingor space 402 may be positioned in each such set to replace a conductivepad. For example, similarly to land pattern portion 400 of FIG. 4, aspace 402 can be located in a set of three edge conductive padpositions. In an embodiment, it is advantageous to use one space 402 forevery three conductive pad positions. The space 402 may be located inany of the three edge conductive pad positions, including a middleconductive pad position. In such an embodiment, any number of such setsof three conductive pad positions may be placed in a particular edge ofa land pattern or array to provide additional routing channels. Thus,the particular edge may have a ratio of conductive pads to spaces of 2to 1, or greater, depending on how many sets are used.

In another embodiment, a number of openings or spaces 402 positioned ina solder ball pad edge portion 220 (i.e., the number of spaces notoccupied by a conductive pad) may be optimized, such that little or nobenefit in signal routing capacity is gained by adding further spaces402 to the edge portion 220, and such that signal routing capacity maybe reduced by removing spaces 402. For example, a optimized number ofspaces 402 may be determined according to an equation, such as Equation1 shown below:S=INT((F−4)/3)  Equation 1Where:

-   -   F=a number of conductive pad positions in an edge portion 220        (i.e., length of the entire edge in solder ball pads, minus one        solder ball pad), if fully populated;    -   S=a number of spaces 402 to be located in the edge portion 220;        and INT is an INTEGER function, rounded down (e.g., INT(3.9)=3).        An example application of Equation 1 is described with respect        to an example land pattern 500, shown in FIG. 5A. As shown in        FIG. 5A, land pattern 500 is a 19×19 array of conductive pad        positions 502. Edge portions of land pattern 500 are designated        as first, second, third, and fourth edge portions 220 a–220 d.        Each of the four edges of land pattern 500 includes 19        conductive pad positions 502. Thus, each of edge portions 220        a–220 d includes 18 conductive pad positions 502 (e.g.,        19−1=18). A number of spaces 402 for an edge portion 220 may be        determined using Equation 1. For example, the number of spaces        402 to be located in edge portion 220 a may be calculated as        follows:        S=INT((18−4)/3)=INT(4.666)=4        Thus, according to Equation 1, the number of spaces 402 to be        located in edge portion 220 a is four. Accordingly, FIG. 5B        shows land pattern 500, revised to include four spaces 402 in        each of edge portions 220 a–d, as calculated by Equation 1,        according to an embodiment of the present invention. Land        pattern 500 of FIG. 5B resultingly has a greater routing channel        capacity than the land pattern of FIG. 5A.

As described above, in an embodiment, an edge can be viewed as includingsets of conductive pad positions. For example, FIG. 5C shows a portionof land pattern 500 of FIG. 5B. As shown in FIG. 5C, an edge of landpattern 500 can be segmented into six sets of three conductivepositions: a first set 530 a, a second set 530 b, a third set 530 c, afourth set 530 d, a fifth set 530 e, and a sixth set 530 f. As shown inFIG. 5C, each of second set 530 b, third set 530 c, fourth set 530 d,and fifth set 530 e have a middle conductive pad position filled with aspace 402. Extra routing channels are available for each of these setsof conductive pad positions due to their respective spaces 402.

In embodiments, a set of conductive pad positions that includes a cornerconductive pad position may or may not include a space 402. In someinstances, little benefit is provided by locating a space 402 in or neara corner, because conductive pads in and near a corner of a land patternare more easily accessed by routing channels. This is because cornerconductive pad positions are accessible from two sides of the landpattern, as opposed to other edge positions, which can only be readilyaccessed from a single side. Thus, in the example embodiment shown inFIG. 5C, no spaces 402 are located in first set 530 a and sixth set 530f. However, in alternative embodiments, one or more spaces 402 may bepositioned in or near the corners of a land pattern, such as in firstand/or sixth sets 530 a and 530 f.

As described above, spaces 402 allow for extra routing channels. FIG. 5Dshows a land pattern 550, which is similar to land pattern 500, withnumerous conductive features shown, including routing channels 204,according to an embodiment of the present invention. As shown in FIG.5D, a larger amount of routing channels 204 is possible in the area inand around spaces 402. This larger amount of routing channels allows fora greater number of conductive pads 202 of land pattern 550 to be routedto destinations outside of land pattern 550. As shown in FIG. 5D,conductive pads 202 in an “isolated” area 540 are not routed todestinations external to land pattern 550. For example, conductive pads202 in area 540 can be power pads, ground pads, test signal pads, or anycombination thereof. All conductive pads 202 outside of isolated area540 are routed by a corresponding routing channel 204 to destinationsexternal to land pattern 550. Without the presence of spaces 402,isolated area 540 would include a larger proportion of isolatedconductive pads 202 of land pattern 550.

Note that Equation 1 may be rewritten in terms of complete edges,instead of edge portions 220, as follows:S=INT(((E−1)−4)/3)orS=INT((E−5)/3)  Equation 1AWhere:

-   -   E=a number of conductive pads in the entire edge of the land        pattern, if fully populated (i.e., E includes both corner pads        and pads between them).        Thus, for land pattern 500 shown in FIG. 5A, a number of spaces        S to be located in a entire edge can be calculated using        Equation 1A, as follows:        S=INT((19−5)/3)=INT(4.666)=4        Thus, Equation 1A arrives at the same result as calculated by        Equation 1 for land pattern 500, above.

Thus, as described above, a number of spaces 402 to be located in one ormore edges of a land pattern can be calculated according to Equations 1and 1A. In alternative embodiments of the present invention, a number ofspaces 402 to be located in an edge of a land pattern can be determinedby referring to a table, such as Table 600, which is shown in FIGS. 6Aand 6B. Table 600 contains information directed to numerous sizes of ICpackages. Table 600 can be referred to by a user, manually, or can beincorporated in an automatic system. The information present in Table600 is described, column by column, in the following paragraphs:

Column 602 shows, for each row of Table 600, an area required by a landpattern or array, having row and column pad/pin counts shown in columns604 and 606. Column 602 shows area data in square inches.

Column 604 shows, for each row of Table 600, a count of pads or pins ina row (X) of the land pattern or array of column 602 (without operationof the present invention).

Column 606 shows, for each row of Table 600, a count of pads or pins ina column (Y) of the land pattern or array of column 602 (withoutoperation of the present invention).

Column 608 shows, for each row of Table 600, a total number of pads orpins for the entire land pattern or array (prior to replacement of anyconductive pads with spaces 402).

Column 610 shows, for each row of Table 600, a total number ofexternally available pads or pins for the entire land pattern or arrayprior to operation of the present invention. “Externally available” padsor pins are those that can be routed outside of the particular landpattern or array on the same substrate layer, and are therefore not“orphaned.”

Column 612 shows, for each row of Table 600, a total number of internalor “orphaned” pads or pins for the entire land pattern or array prior tooperation of the present invention. Internal or “orphaned” pads or pinsare those that cannot be routed outside of the particular land patternor array on the same substrate layer as the externally available pads orpins. Note that some IC package signals may be coupled to internal pinswithout substantially affecting package performance. For example, suchpins include power and/or ground, which are coupled to power and/orground planes in the PCB (through vias) when the IC package is mountedto the PCB. Other IC package signals that are coupled to internal ororphaned pins may include proprietary signals used only during test ofthe IC package, and other signals used during development of the PCBassembly.

Column 614 shows, for each row of Table 600, a percentage of pads orpins that are internal or orphaned for the entire land pattern or array(without operation of the present invention). Thus, for each row, avalue in column 614 may be calculated as follows:${{value}\mspace{14mu}{in}\mspace{14mu}{column}\mspace{14mu} 614} = {\frac{{value}\mspace{14mu}{in}\mspace{14mu}{column}\mspace{14mu} 612}{{value}\mspace{14mu}{in}\mspace{14mu}{column}\mspace{14mu} 610} \times 100}$

Column 616 shows, for each edge row of the particular land pattern orarray, a number of pads present (not counting one of the corner pads),after removal of peripheral pads or pins according to the presentinvention.

Column 618 shows, for each edge column of the particular land pattern orarray, a number of pads present (not counting one of the corner pads),after removal of peripheral pads or pins according to the presentinvention.

Column 620 shows, for each row of Table 600, a resulting total number ofpads or pins remaining for the entire land pattern or array, afterremoval of peripheral pads or pins according to the present invention.

Column 622 shows a total number of externally available pads or pins forthe entire land pattern or array after removal of pads or pins accordingto the present invention.

Column 624 shows a total number of internal or “orphaned”, unavailablepads or pins for the entire land pattern or array after removal of padsor pins according to the present invention.

Column 626 shows a percentage of pads or pins that are internal ororphaned for the entire land pattern or array after removal of pads orpins according to the present invention. Thus, for each row, a value incolumn 626 may be calculated as follows:${{value}\mspace{14mu}{in}\mspace{14mu}{column}\mspace{14mu} 626} = {\frac{{value}\mspace{14mu}{in}\mspace{14mu}{column}\mspace{14mu} 624}{{value}\mspace{14mu}{in}\mspace{14mu}{column}\mspace{14mu} 622} \times 100}$

Columns 628–650 show a total number of externally available pads or pinsfor the entire land pattern or array after removal of pads or pins foradditional routing channels, that is further reduced due to a selectednumber of externally accessible power channels. In the present example,for every external power channel selected, the number of externallyavailable pins is reduced by two. Thus, the values in columns 628–650may be calculated as follows: $\begin{matrix}{{each}\mspace{14mu}{value}} \\{{in}\mspace{14mu}{columns}} \\{628\text{-}650}\end{matrix} = {\begin{matrix}{{value}\mspace{14mu}{in}} \\{{column}\mspace{14mu} 622} \\\;\end{matrix} - \begin{matrix}{2 \times {number}\mspace{14mu}{of}\mspace{14mu}{external}} \\{{power}\mspace{14mu}{channels}\mspace{14mu}{selected}} \\\left( {{value}\mspace{14mu}{in}\mspace{14mu}{row}\mspace{14mu} 652} \right)\end{matrix}}$Note that in alternative embodiments, the number of externally availablepins may be reduced by amounts greater or less than two. FIG. 5D showsseveral example power channels 590, according to the present invention.

Thus, information in Table 600 shown in FIGS. 6A and 6B can be consultedto determine a number of spaces 402 to be positioned in one or moreedges of a land pattern or array. For example, a row 660 of Table 600,shown in FIG. 6A, can be consulted for land pattern 500 of FIG. 5A. Asshown in columns 604 and 606 of Table 600, row 660 applies to a 19×19array of pad positions, such as land pattern 500. Columns 616 and 618indicate that edge portions (i.e., not counting one of the corner padpositions of the edge) can be modified to include 14 solder ball pads.This is shown in FIG. 5B, where four spaces 402 are positioned in eachof edge portions 220 a–220 d of land pattern 500. Thus, Table 600provides a result similar to that for Equations 1 and 1A describedabove. Information present in Table 600 may be referred to for any landpattern or array of sizes 11×11 through 31×31. Furthermore, theinformation of Table 600 may be extended to larger and smaller landpattern and array sizes, as would be understood by persons skilled inthe relevant art(s) from the teachings herein. The present invention canbe applied to array and land patterns of any size, even sizes muchgreater than 31×31.

Table 600 also provides an indication of routing channel improvementsdue to embodiments of the present invention. As shown in column 608 forrow 660 of Table 600, land pattern 500 originally had 361 pads or pins(i.e., as shown in FIG. 5A). As indicated in column 620, after inclusionof four spaces 402 in each edge of land pattern 500 (i.e., as shown inFIG. 5B), land pattern 500 can have a total number of 345 pads or pins.As indicated in column 610, land pattern 500 originally had 216 pads orpins that were externally accessible by routing channels. As indicatedin column 622, land pattern 500 can have 248 pads or pins that areexternally accessible by routing channels, an increase of 32 pads orpins. As indicated in columns 612 and 624, the number of internal ororphaned pads or pins has been reduced from 145 to 97. Thus, whilereducing a total pad or pin count for land pattern 500 by 16 pads orpins, 32 additional pads or pins are available for signal routing inland pattern 550. Thus, the present invention increases the availabilityof pads or pins.

In the example of land pattern 550 shown in FIG. 5D, six power channels590 are present. Column 638 of Table 600 indicates that in anembodiment, a total of 236 pads or pins can be externally accessible byrouting channels when six power channels 590 are present. Thus, landpattern 550 is shown in FIG. 5D having 236 externally accessible routingchannels, corresponding to 236 pads or pins. Land pattern 550 has 69orphaned pads or pins in a central region. Land pattern 69 has 40 padsor pins coupled to the six power channels 590. Thus, a sum of the 236pads or pins, 69 orphaned pads or pins, and 40 pads or pins coupled topower channels 590 equals the total of 345 pads or pins shown in column620 of Table 600. Thus, example land pattern 550 has a greater number ofrouting channels than indicated in column 610, and fewer orphaned padsor pins than are indicated in column 612 of Table 600.

Thus, the present invention increases the availability of pads or pins,which therefore allows the use of smaller package sizes, and fewerrouting layers, for example.

Embodiments Improving Routing Capacity by Adding Pads

As described above, in an embodiment, routing capacity is improved for aland pattern or array by adding a non-fully populated perimeter edge orside of pads or pins to the land pattern or array. Additional routingchannels are provided by spaces or openings formed by missing pins inthe added non-fully populated perimeter side. Any number of one or morenon-fully populated edges may be added to the land pattern or array. Theadditional perimeter of conductive pads can have spaces 402 formedtherein for additional routing channels, according to the presentinvention. The number and location of spaces 402 can be selectedmanually and/or automatically, or as described elsewhere herein.

In an embodiment, Equations 1 and/or 1A, and Table 600, may be used todetermine a number of spaces 402 to use in an added non-fully populatedperimeter edge. Furthermore, when an additional perimeter of conductivepads is added to entirely surround an array or land pattern, Equations 1and/or 1A, and Table 600, may be used to determine a number of spaces402 to use in each of the four added non-fully populated edges.

In another embodiment, when an additional perimeter of conductive padsis added to entirely surround a land pattern or array, the number ofspaces 402 to be placed in each new edge of can be calculated accordingto Equation 2, shown below:S=INT((F−2)/3)  Equation 2Where:

-   -   S=a number of spaces to be located in each edge portion of the        additional surrounding perimeter of conductive pads;    -   F=a number of conductive pad positions in an edge portion of the        array of land pattern before adding the additional surrounding        perimeter of conductive pads; and    -   INT is the INTEGER function, rounded down (e.g., INT(3.9)=3).        For example, routing for land pattern 500 shown in FIG. 5 may be        improved in this manner. Each of edge portions 220 a–220 d of        land pattern 500 include 18 solder ball pad positions 502 (e.g.,        19−1=18). FIG. 7A shows a land pattern 700, which is similar to        land pattern 500, with an additional perimeter of conductive        pads entirely surrounding land pattern 500. Land pattern 700 is        a 21×21 array of conductive pad positions. The additional        perimeter of conductive pads are shown included in edge portions        720 a–720 d.

The number of spaces 402 to be located in an edge portion 720 may becalculated according to Equation 2 as follows:S=INT((18−2)/3)=INT(5.333)=5Thus, the number of spaces 402 to be located in an edge portion of theadditional periphery of solder ball pads, according to Equation 2, isfive. FIG. 7B shows an example land pattern 750, similar to land pattern500, with an additional non-fully populated perimeter of solder ballpads, according to an embodiment of the present invention. Each of edgeportions 720 a–720 d include five spaces 402, as calculated by Equation2.

Note that Equation 2 may be rewritten in terms of complete edges,instead of edge portions 220, as follows:S=INT((E−1)−2)/3)orS=INT((E−3)/3)  Equation 2AWhere:

-   -   E=a number of conductive pads in an edge of the land pattern,        prior to addition of the surrounding perimeter of conductive        pads, if fully populated (i.e., E includes both corner pads and        pads between them for an edge).        Example Embodiments for Designing Land Patterns and Arrays

The present invention may be used to design IC package arrays and/orland patterns for interfacing with an IC package. FIG. 8 shows anexample flowchart 800 providing steps for designing one or moreembodiments of the present invention. The steps of FIG. 8 do notnecessarily have to occur in the order shown, as will be apparent topersons skilled in the relevant art(s) based on the teachings herein.Other structural embodiments will be apparent to persons skilled in therelevant art(s) based on the following discussion. These steps aredescribed in detail below.

Flowchart 800 begins with a step 802. In step 802, a number of requiredpins is determined. For example, a user or automatic system maydetermine a required number of signals needed to couple to a PCB by apackage, therefore determining the required number of pins or pads.

In step 804, a number of required perimeter routing channels isdetermined. In an embodiment, the signals corresponding to the requirednumber of pins determined in step 802 can be evaluated to determinewhich need to be routed external to the array or land pattern. Forexample, at least some ground, power, and/or other signals may beselected to be included in the group of internal or “orphaned” pads/pinsnot needing to be externally routed. Once the number of internalpads/pins is determined, a number of pads/pins that require to beexternally routed using routing channels will be known.

In step 806, an array or land pattern is selected to yield the requiredpads or pins. For example, the user or automatic system can choose anN×M size array having the required number of pins/pads determined instep 802. In an embodiment, a table, such as Table 600 may be referredto for this selection. For example, column 608 indicates a number oftotal pads/pins for a given N×M size array.

In step 808, a size of the array or land pattern is optimized to yieldthe required perimeter routing channels, wherein at least one perimeterside of the array is under-populated. For example, the number ofpads/pins needing routing channels determined in step 804 can becompared to the external routing channel capacity of the selected N×Msize array. In an embodiment, a table, such as Table 600 can be referredto for this comparison. For example, column 610 indicates a number ofexternally available pads or pins for the land pattern. If additionalrouting channels are required, one or more pads/pins can be added orremoved from one or more peripheral edges of the N×M size array. Thus,in an embodiment, step 808 includes under populating at least oneperimeter edge of the array or land pattern. For example, FIG. 5B aboveshows the removing of pad/pins (i.e., or adding of spaces 402) to anedge of a land pattern to under populate a perimeter edge. In anotherexample, FIG. 7B shows the adding of an under-populated edge ofpads/pins to an edge of a land pattern to under populate a perimeteredge.

In embodiments, a number of added or removed pins/pads may be determinedmanually or automatically. Furthermore, Table 600 may be referred to,and/or Equations 1, 1A, 2, and/or 2A may be used to determine the numberof added or removed pins/pads.

Once the array or land pattern has been optimized, signals may be routedfrom pads internal to the land pattern through openings formed bymissing pads in the non-fully populated perimeter edge(s).

Example Applications of the Present Invention

For illustrative purposes, Table 600 described above relates to landpatterns and arrays having the sizes indicated in column 602. However,the present invention is not limited to these sizes, but instead isapplicable to land patterns and arrays of any size. For example, Table900 shown in FIG. 9 provides additional sizes to which the presentinvention is applicable. Table 900 is described as follows:

Columns 902, 904, and 906 of Table 900 relate to example land patternand array sizes having various pad/pin counts. Columns 902 and 904respectively show row (X) and column (Y) pad/pin counts. Column 906indicates a total pad/pin count for fully populated land patterns andarrays having the row and column counts indicated by columns 902 and904.

Columns 908, 910, 912, 914, 916, 918, and 920 each show substrate areasrequired by the land patterns or arrays having the sizes of columns 902,904, and 906, for different trace/pad technologies. Area data is shownin square inches. Note that column 908 relates to an area equivalent tothat shown in column 602 of Table 600. Rows 930, 932, 934, and 936provide dimension data for the trace/pad technologies of columns 908,910, 912, 914, 916, 918, and 920.

Row 930 indicates line widths for routing channels for the varioustrace/pad technologies of columns 908, 910, 912, 914, 916, 918, and 920.

Row 932 indicates a spacing between routing channels for the varioustrace/pad technologies of columns 908, 910, 912, 914, 916, 918, and 920.

Row 934 indicates a pad width/length for the various trace/padtechnologies of columns 908, 910, 912, 914, 916, 918, and 920.

Row 936 indicates a pitch, or distance center to center for adjacentpads, for the various trace/pad technologies of columns 908, 910, 912,914, 916, 918, and 920.

Table 900 provides relevant data for a variety of IC package sizes.Columns 610–650 of Table 600 can be referred to for additionalinformation regarding the various technologies of Table 900. Forexample, as indicated by rows 930–936, of Table 900, column 912 relatesto a trace/pad technology having a channel routing width of 0.006inches, a routing channel spacing of 0.006, a pad width/length of 0.029inches, and a pad pitch of 0.060 inches. A row 940 of Table 900 providesinformation regarding a 19×19 land pattern or array, similar to landpattern 500 shown in FIG. 5A. For row 940, columns 908–920 show landpattern or array sizes ranging from 0.90 to 2.31 square inches. Columns610–650 of row 660 of Table 600 (shown in FIG. 6A) can be referred tofor a 19×19 array of any of the sizes provided in row 940. In a similarfashion, the information provided in Table 600 can be related to anyother of the trace/pad technologies shown in Table 900.

The various trace/pad technologies and land pattern/array sizes providedin Table 900 are provided for illustrative purposes, and are notlimiting. The present invention is applicable to any trace/padtechnologies and land pattern/array sizes, as would be understood bypersons skilled in the relevant art(s) from the teachings herein. Thus,from the teachings herein, it will be apparent to persons skilled in therelevant art(s) how to improve signal routing by adding or removingpins/pads for land patterns and arrays of any size.

Multi-Layer Embodiments of the Present Invention

Embodiments of the present invention are applicable to circuitboards/substrates having any number of layers. In such embodiments,different portions of the pads/pins of a solder ball array/land patterncan be coupled to externally accessible routing channels on differentlayers.

For example, FIGS. 10–15 show various layers in an example multi-layercircuit board embodiment of the present invention. FIG. 10 shows anexample top assembly view 1010 of a circuit board 1000. For example, aball grid array package can be attached to the land pattern centrallylocated on circuit board 1000 in view 1010. The land pattern shown inFIG. 10 includes various conductive features, including an array ofconductive pads and routing channels. The array is a 32×32 pad/pinarray, having 1024 pads/pins (prior to operation of the presentinvention). A first portion of the pads/pins of the 32×32 pad/pin arrayare shown on a top layer in FIG. 10 coupled to externally availablerouting channels. In the example of FIG. 10, the first portion ofpads/pins that are externally routed are located in the peripheral fiverows/columns of the land pattern.

Printed circuit board 1000 comprises a substrate material, and caninclude one or more layers in which conductive features are formed, inaddition to the layer shown in FIG. 10. FIG. 11 shows a top etch view1100 of circuit board 1000, which shows the layer shown in FIG. 10 as itwould actually be etched.

FIG. 12 shows a ground layer view 1200 of circuit board 1000. Groundlayer view 1200 shows a ground plane of circuit board 1000.

FIG. 13 shows a power layer view 1300 of circuit board 1000. Power layerview 1300 shows a power plane of circuit board 1000.

FIG. 14 shows a bottom etch view 1400 of circuit board 1000. FIG. 15shows a bottom assembly view 1500 of circuit board 1000. View 1500 (andview 1400) shows on a bottom layer of circuit board 1000 a portion ofthe land pattern shown in FIG. 10. View 1500 shows conductive featureson the bottom of circuit board 1000, including the innermost 25×25 arrayof pads/pins of the land pattern of FIG. 10. FIGS. 12 and 13 show viascorresponding to the 25×25 array of pads/pins, for electrically couplingthe 25×25 array of pads/pins between the layers shown in views 1010 and1500. As described above, a first portion of the 32×32 pad/pin array areshown externally routed in top assembly view 1010 of FIG. 10. A secondportion of pads of the original 32×32 pad/pin array of FIG. 10 are showncoupled to externally available routing channels in view 1500. Thissecond portion of pads/pins is located in the peripheral fivecircumferential rows of the 25×25 array portion shown in FIG. 15. Thus,a first portion of the land pattern of FIG. 10 is routed on a firstlayer of circuit board 1000, while a second portion of the land patternis routed on a second layer of circuit board 1000.

To provide additional routing channels, spaces are located in theperipheral edges of the 32×32 pad/pin array shown in FIG. 10.Furthermore, additional routing channels are provided by locating spacesin the peripheral edges of the 25×25 pad/pin array shown in FIG. 15.Some conductive pads shown routed in view 1010 are replaced with spacesin the peripheral edges of the 25×25 pad/pin array shown in view 1500 toprovide additional routing channels for the 25×25 pad/pin array. Itwould be understood to persons skilled in the relevant art(s) from theteachings herein how to remove pads/pins from and/or add pads/pins foreach layer of the multi-layer embodiment example of FIGS. 10–15 toenhance signal routing.

In an embodiment, the number of pads/pins that are routed on a firstrouting layer is maximized, leaving as few as possible pads/pins toroute on a subsequent layer(s). Note, however, in alternativeembodiments, any proportion of pads/pins can be routed on any layer,according to the present invention. Note that on layers subsequent tothe first or top routing layer, the pads/pins may be more appropriatelyreferred to as “vias”, although for illustrative purposes, they willtypically be referred to as pads/pins herein. Thus, the presentinvention is also applicable to design of arrays of vias in PCBs and ICpackages.

In the current example, 436 pads/pins are routed on the first routinglayer (shown in FIG. 10), and 340 pads/pins are routed on the secondrouting layer (shown in FIG. 15). Eight pads/pins have been removed fromeach edge of the 32×32 array shown in FIG. 10. Seven pads/pins/vias havebeen removed from each edge of the 25×25 array portion shown in FIG. 15.In alternative embodiments, fewer or greater numbers of pads/pins may beremoved.

FIG. 16 shows a Table 1600 showing a pad/pin layout for the examplemulti-layer land pattern embodiment of FIGS. 10–15, according to anembodiment of the present invention. In FIG. 16, a “T” represents apad/pin that is routed on the layer shown in FIG. 10 (e.g., top layer),and a “B” represents a pad/pin that is routed on the layer shown in FIG.15 (e.g., bottom layer). A “N” represents a position where there is nopad/pin. “AG” represents analog ground, “AP1” and “AP2” represent analogpower, “DG” represents digital ground, and “DP1” and “DP2” representdigital power.

In a multi-layer embodiment, flowchart 800 of FIG. 8 can be modified toinclude an additional step where a number of layers of the printedcircuit board to have routing channels is determined. This step canoccur at any point in flowchart 800. The printed circuit board can haveany number of one or more layers that include routing channels,including two such layers, three such layers, and greater numbers oflayers. The determination of the number of layers can be made manuallyor automatically.

Furthermore, in a multi-layer embodiment, step 804 of flowchart 800 canbe modified such that a number of required perimeter routing channels isdetermined for an array of conductive pads on each layer of thedetermined number of layers. Step 808 can also be modified such that asize of the land pattern is optimized to yield the required perimeterrouting channels in each layer. Step 808 can include the step where atleast one perimeter edge is under populated on at least one layer. Thus,in a two-routing layer embodiment, either layer, or both layers can haveedges that are under populated by incorporating one or more spaces.

The multi-layer land pattern embodiment shown in FIGS. 10–16 is providedfor illustrative purposes, and is not limiting. The present invention isapplicable to any land pattern/array size, on any number of layers, aswould be understood by persons skilled in the relevant art(s) from theteachings herein. Thus, from the teachings herein, it will be apparentto persons skilled in the relevant art(s) how to improve signal routingby adding or removing pins/pads for land patterns and arrays of anysize, on any number of layers.

Embodiments for Land Patterns with Selected Corner Pad Arrangements

The description above relates to the positioning of spaces in edges ofsolder ball arrays/land patterns. This subsection describes embodimentsfor arrangements of pads/spaces in and near corners of solder ballarrays/land patterns. More specifically, this subsection providesembodiments relating the proximity of spaces to corners of solder ballarrays/land patterns. The description below is applicable to bothsingle-layer and multi-layer embodiments of the present invention.

As described above with respect to FIG. 4, a space 402 in an edge of aland pattern portion 400 allows for additional routing channels 204, ascompared to land patterns that do not include a space 402. For example,FIG. 17A shows an example land pattern portion 1700 having aconventional arrangement of conductive pads 202. FIG. 17B shows anexample land pattern portion 1750 having conductive pads 202 and a space402 configured according to an embodiment of the present invention. Asshown in FIG. 17A, nine conductive pads 202 b–d, 202 f–h, and 202 j–lcan be routed out of portion 1700 by nine respective routing channels204 a–i. As shown in FIG. 17B, conductive pad 202 h has been replacedwith an opening or space 402. Thus, eleven conductive pads 202 a–g and202 i–l can be routed out of land pattern portion 1750 by eleven routingchannels 204 a–204 k. In FIG. 17A, all conductive pads 202 that arethree columns (or rows) deep from the edge of land pattern portion 1700can be externally routed. In FIG. 17B, all conductive pads 202 presentthat are four columns (or rows) deep from the edge of land patternportion 1750 can be routed, when a single space 402 is present.

As described above with respect to FIG. 5C, a set 530 of two solder ballpads 202 surrounding a space 402 in an edge can be repeated on the edge,to provide additional routing channels throughout the edge. Inembodiments of the present invention, a set 530 can be positioned in theedge as dictated by a corner pad arrangement. As used herein, a “cornerpad arrangement,” “corner arrangement,” or “pad arrangement for a cornerportion” is defined by an arrangement of conductive pads in two edgesthat converge at a corner of an array/land pattern. In other words, padsof a corner pad arrangement are pads along two edges going out from acorner, until a pad prior to a space is encountered. A corner padarrangement can also be considered to be a line of pads beginning in afirst edge after a pad after a first space, extending to a corner,extending around the corner, and along a second edge until a pad priorto a second space is encountered. In embodiments, a corner padarrangement can include additional pads. Different corner padarrangements have various numbers of pads along the edges. Furthermore,a corner pad arrangement has one or more known characteristics, such asa number of lost or unusable routing channels. This number can be usedin conjunction with the number of routing channels gained by usingspaces 402 in an edge to determine an overall routing channel capacityfor an edge, or even for an entire array/land pattern.

FIG. 17B shows an example set 1710 similar to set 530, but also showingexample routing, according to an example embodiment of the presentinvention. As shown in FIG. 17B, set 1710 includes a first pad 202 d, aspace 402, and a second pad 2021 arranged in series along an edge.Furthermore, as described above, set 1710 allows for eleven routingchannels 204 a–k. The pads and routing of set 1710, or routing similarthereto, can be repeated (e.g., copied from a library) on an edge anynumber of times to provide known or predetermined routing of signals onedges. Set 1710 can be used adjacent to particular corner padarrangements to provide predictable routability. For example, FIG. 17Cshows an edge portion 1770 of a land pattern/array with a conventionaledge pad arrangement, and routing. FIG. 17D shows an edge portion 1780of a land pattern/array that incorporates a series arrangement of sets1710 a–f to provide additional routing channels, in a predictablemanner. As compared to edge portion 1770, edge portion 1780 has sixfewer edge pads 202, but is capacity for routing twelve more pads 202externally.

Various unique corner pad arrangements are described below. FIGS. 18–32show fifteen corner arrangements, according to example embodiments ofthe present invention. The corner pad arrangements can be used to aid indetermining an overall number of routing channels for an array/landpattern, and can also be used to aid in positioning spaces in edges. Forillustrative purposes, only two outer rows and columns of the corner padpositions are shown in FIGS. 18–32.

FIG. 18 shows a corner arrangement 1800, according to an exampleembodiment of the present invention. Corner arrangement 1800 is locatedin a corner of a land pattern or array, at an intersection of first andsecond edges 1802 and 1804. Corner arrangement 1800 includes a cornerpad 1810. A set of four corner pads 1812 is also shown. Cornerarrangement 1800 is considered a “two-by-three” arrangement, because infirst edge 1802, two pads 1822 and 1824 are present between corner pad1810 and adjacent set 1710 a, and in second edge 1804, three pads 1832,1834, and 1836 are present between corner pad 1810 and adjacent set 1710b. Alternatively, corner arrangement 1800 is considered a “two-by-three”arrangement because two routing areas 1842 and 1844 between pads arepresent between adjacent set 1710 a and corner pads 1812, and threerouting areas 1862, 1864, and 1866 between pads are present betweenadjacent set 1710 b and corner pads 1812.

Note that corner arrangement 1800 represents two corner padarrangements: (1) the two-by-three arrangement of pads shown in FIG. 18;and (2) a three-by-two arrangement of pads that would result by swappingthe positions of first and second edges 1802 and 1804 around corner pad1810 in FIG. 18.

The two-by-three and three-by-two arrangements represented by cornerarrangement 1800 are desirable corner pad arrangements. Example signalrouting channels are shown for corner arrangement 1800 in FIG. 18. Asshown in FIG. 18, two routing channels are routed through each ofrouting areas 1842, 1844, 1862, 1864, and 1866, and the routing areasadjacent to corner pad 1810, from internal to the land pattern/array toexternal of the land pattern/array through first and second edges 1802and 1804. Thus, a maximum number of routing channels for each routingarea proximate to the corner are used, and no routing channels are lostwhen using corner arrangement 1800.

FIG. 19 shows a corner arrangement 1900, according to an exampleembodiment of the present invention. Corner arrangement 1900 is locatedin a corner of a land pattern or array, at an intersection of first andsecond edges 1802 and 1804. Corner arrangement 1900 includes a cornerpad 1910. A set of four corner pads 1912 is also shown. Cornerarrangement 1900 is considered a “two-by-four” arrangement, because infirst edge 1802, two pads 1922 and 1924 are present between corner pad1910 and adjacent set 1710 a, and in second edge 1804, four pads 1932,1934, 1936, and 1938 are present between corner pad 1910 and adjacentset 1710 b. Alternatively, corner arrangement 1900 is considered a“two-by-four” arrangement because two routing areas 1942 and 1944between pads are present between adjacent set 1710 a and corner pads1912, and four routing areas 1962, 1964, 1966, and 1968 between pads arepresent between adjacent set 1710 b and corner pads 1912.

Note that corner arrangement 1900 represents two corner padarrangements: (1) the two-by-four arrangement of pads shown in FIG. 19;and (2) a four-by-two arrangement of pads that would result by swappingfirst and second edges 1802 and 1804 in FIG. 19.

The two-by-four and four-by-two arrangements represented by cornerarrangement 1900 are desirable corner pad arrangements, although lessdesirable than corner arrangement 1800 of FIG. 18. Corner arrangement1900 is less desirable than corner arrangement 1800 because a routingchannel is lost or unused. Example signal routing channels are shown forcorner arrangement 1900 in FIG. 19. As shown in FIG. 19, two routingchannels are routed through each of routing areas 1942, 1944, 1962,1964, and 1968, and the routing areas adjacent to corner pad 1910, frominternal to the land pattern/array to external of the land pattern/arraythrough first and second edges 1802 and 1804. However, an internalrouting channel 1980 is unable to be routed through routing area 1966.Thus, a maximum number of routing channels for each routing area is notused, as one internal routing channel is lost when using cornerarrangement 1900. However, a loss of one routing channel may beacceptable, or a best option, in some land pattern/arrays.

FIG. 20 shows a corner arrangement 2000, according to an exampleembodiment of the present invention. Corner arrangement 2000 is locatedin a corner of a land pattern or array, at an intersection of first andsecond edges 1802 and 1804. Corner arrangement 2000 includes a cornerpad 2010. A set of four corner pads 2012 is also shown. Cornerarrangement 2000 is considered a “three-by-three” arrangement, becausein first edge 1802, three pads 2022, 2024, and 2026 are present betweencorner pad 2010 and adjacent set 1710 a, and in second edge 1804, threepads 2032, 2034, and 2036 are present between corner pad 2010 andadjacent set 1710 b. Alternatively, corner arrangement 2000 isconsidered a “three-by-three” arrangement because three routing areas2042, 2044, and 2046 between pads are present between adjacent set 1710a and corner pads 2012, and three routing areas 2062, 2064, and 2066between pads are present between adjacent set 1710 b and corner pads2012.

The three-by-three arrangement represented by corner arrangement 2000 isa desirable corner pad arrangement, although less desirable than cornerarrangement 1800 of FIG. 18. Corner arrangement 2000 is less desirablethan corner arrangement 1800 because a routing channel is lost orunused. Example signal routing channels are shown for corner arrangement2000 in FIG. 20. As shown in FIG. 20, two routing channels are routedthrough each of routing areas 2042, 2046, 2062, 2064, and 2066, and therouting areas adjacent to corner pad 2010, from internal to the landpattern/array to external of the land pattern/array through first andsecond edges 1802 and 1804. However, an internal routing channel 2080 isunable to be routed through routing area 2044. Thus, a maximum number ofrouting channels for each routing area is not used, as one internalrouting channel is lost when using corner arrangement 2000. However, aloss of one routing channel may be acceptable, or a best option, in someland pattern/arrays.

FIGS. 21–32 show corner arrangements that are even less desirable thanthose shown in FIGS. 18–20 due to loss of further routing channels.However, the corner arrangements shown in FIGS. 21–32 may be appropriatefor use in some land pattern/arrays.

FIG. 21 shows a corner arrangement 2100, according to an exampleembodiment of the present invention. Corner arrangement 2100 isconsidered a “zero-by-zero” arrangement, because in first edge 1802, nopads are present between corner pad 2110 and adjacent set 1710 a, and insecond edge 1804, no pads are present between corner pad 2110 andadjacent set 1710 b. Alternatively, corner arrangement 2100 isconsidered a “zero-by-zero” arrangement because no routing areas betweenpads are present between adjacent set 1710 a and corner pads 2112, andno routing areas between pads are present between adjacent set 1710 band corner pads 2112.

Corner arrangement 2100 is less desirable than corner arrangement 1800because five routing channels are lost or unused. Example signal routingchannels are shown for corner arrangement 2100 in FIG. 21. As shown inFIG. 21, five routing channels 2172, 2174, 2176, 2178, and 2180 cannotbe routed external of the land pattern/array through first and secondedges 1802 and 1804. Thus, five external routing channels are lost orunused in corner arrangement 2100.

FIG. 22 shows a corner arrangement 2200, according to an exampleembodiment of the present invention. Corner arrangement 2200 isconsidered a “zero-by-one” arrangement, because in first edge 1802, nopads are present between corner pad 2210 and adjacent set 1710 a, and insecond edge 1804, one pad 2232 is present between corner pad 2210 andadjacent set 1710 b. Alternatively, corner arrangement 2200 isconsidered a “zero-by-one” arrangement because no routing areas betweenpads are present between adjacent set 1710 a and corner pads 2212, andone routing area 2262 between pads is present between adjacent set 1710b and corner pads 2212.

Note that corner arrangement 2200 represents two corner padarrangements: (1) the zero-by-one arrangement of pads shown in FIG. 22;and (2) a one-by-zero arrangement of pads that would result by swappingfirst and second edges 1802 and 1804 in FIG. 22.

Corner arrangement 2200 is less desirable than corner arrangement 1800because routing channels are lost or unused. Example signal routingchannels are shown for corner arrangement 2200 in FIG. 22. As shown inFIG. 22, four routing channels 2272, 2274, 2276, and 2278 cannot berouted external of the land pattern/array through first and second edges1802 and 1804. Thus, four external routing channels are lost or unusedin corner arrangement 2200.

FIG. 23 shows a corner arrangement 2300, according to an exampleembodiment of the present invention. Corner arrangement 2300 representsa “zero-by-two” or “two-by-zero” arrangement. Corner arrangement 2300 isless desirable than corner arrangement 1800 because routing channels arelost or unused. Example signal routing channels are shown for cornerarrangement 2300 in FIG. 23. As shown in FIG. 23, three routing channels2372, 2374, and 2376 cannot be routed external of the land pattern/arraythrough first and second edges 1802 and 1804. Thus, three externalrouting channels are lost or unused in corner arrangement 2300.

FIG. 24 shows a corner arrangement 2400, according to an exampleembodiment of the present invention. Corner arrangement 2400 representsa “zero-by-three” or “three-by-zero” arrangement. Corner arrangement2400 is less desirable than corner arrangement 1800 because routingchannels are lost or unused. Example signal routing channels are shownfor corner arrangement 2400 in FIG. 24. As shown in FIG. 24, two routingchannels 2472 and 2474 cannot be routed external of the landpattern/array through first and second edges 1802 and 1804. Thus, twoexternal routing channels are lost or unused in corner arrangement 2400.

FIG. 25 shows a corner arrangement 2500, according to an exampleembodiment of the present invention. Corner arrangement 2500 representsa “zero-by-four” or “four-by-zero” arrangement. Corner arrangement 2500is less desirable than corner arrangement 1800 because routing channelsare lost or unused. Example signal routing channels are shown for cornerarrangement 2500 in FIG. 25. As shown in FIG. 25, three routing channels2572, 2574, and 2576 cannot be routed external of the land pattern/arraythrough first and second edges 1802 and 1804. Routing channels 2572 and2574 are lost or unused in edge 1802, and routing channel 2576 is lostor used internally to the land pattern/array. Thus, two external routingchannels and one internal routing channel are lost or unused in cornerarrangement 2500.

FIG. 26 shows a corner arrangement 2600, according to an exampleembodiment of the present invention. Corner arrangement 2600 representsa “one-by-one” arrangement. Corner arrangement 2600 is less desirablethan corner arrangement 1800 because routing channels are lost orunused. Example signal routing channels are shown for corner arrangement2600 in FIG. 26. As shown in FIG. 26, three routing channels 2672, 2674,and 2676 cannot be routed external of the land pattern/array throughfirst and second edges 1802 and 1804. Thus, three external routingchannels are lost or unused due to corner arrangement 2600.

FIG. 27 shows a corner arrangement 2700, according to an exampleembodiment of the present invention. Corner arrangement 2700 representsa “one-by-two” or “two-by-one” arrangement. Corner arrangement 2700 isless desirable than corner arrangement 1800 because routing channels arelost or unused. Example signal routing channels are shown for cornerarrangement 2700 in FIG. 27. As shown in FIG. 27, two routing channels2772 and 2774 cannot be routed external of the land pattern/arraythrough first and second edges 1802 and 1804. Thus, two external routingchannels are lost or unused in corner arrangement 2700.

FIG. 28 shows a corner arrangement 2800, according to an exampleembodiment of the present invention. Corner arrangement 2800 representsa “one-by-three” or “three-by-one” arrangement. Corner arrangement 2800is less desirable than corner arrangement 1800 because routing channelsare lost or unused. Example signal routing channels are shown for cornerarrangement 2800 in FIG. 28. As shown in FIG. 28, one routing channel2872 cannot be routed from internal of the land pattern/array throughfirst and second edges 1802 and 1804. Thus, one external routing channelis lost or unused in corner arrangement 2800.

FIG. 29 shows a corner arrangement 2900, according to an exampleembodiment of the present invention. Corner arrangement 2900 representsa “one-by-four” or “four-by-one” arrangement. Corner arrangement 2900 isless desirable than corner arrangement 1800 because routing channels arelost or unused. Example signal routing channels are shown for cornerarrangement 2900 in FIG. 29. As shown in FIG. 29, two routing channels2972 and 2974 cannot be routed external of the land pattern/arraythrough first and second edges 1802 and 1804. Routing channel 2972 islost or unused in edge 1802, and routing channel 2974 is lost or usedinternally to the land pattern/array. Thus, one external and oneinternal routing channel are lost or unused in corner arrangement 2900.

FIG. 30 shows a corner arrangement 3000, according to an exampleembodiment of the present invention. Corner arrangement 3000 representsa “two-by-two” arrangement. Corner arrangement 3000 is less desirablethan corner arrangement 1800 because routing channels are lost orunused. Example signal routing channels are shown for corner arrangement3000 in FIG. 30. As shown in FIG. 30, one routing channel 3072 cannot berouted external of the land pattern/array through first and second edges1802 and 1804. Thus, one external routing channel is lost or unused incorner arrangement 3000.

FIG. 31 shows a corner arrangement 3100, according to an exampleembodiment of the present invention. Corner arrangement 3100 representsa “three-by-four” or “four-to-three” arrangement. Corner arrangement3100 is less desirable than corner arrangement 1800 because routingchannels are lost or unused. Example signal routing channels are shownfor corner arrangement 3100 in FIG. 31. As shown in FIG. 31, two routingchannels 3172 and 3174 cannot be routed internally from the landpattern/array through first and second edges 1802 and 1804. Thus, twointernal routing channels are lost or unused in corner arrangement 3100.

FIG. 32 shows a corner arrangement 3200, according to an exampleembodiment of the present invention. Corner arrangement 3200 representsa “four-by-four” arrangement. Corner arrangement 3200 is less desirablethan corner arrangement 1800 because routing channels are lost orunused. Example signal routing channels are shown for corner arrangement3200 in FIG. 32. As shown in FIG. 32, three routing channels 3272, 3274,and 3276 cannot be routed internally from the land pattern/array throughfirst and second edges 1802 and 1804. Thus, three internal routingchannels are lost or unused in corner arrangement 3200.

In an embodiment, a layout designer or automated system may use alibrary that includes the corner pad arrangements described above toassist in creating ball layouts. For example, any one or more of cornerarrangements 1800, 1900, 2000, 2100, 2200, 2300, 2400, 2500, 2600, 2700,2800, 2900, 3000, 3100, and 3200 may be included in such a library.Therefore, a land pattern could be at least partially designed byselecting one or more corner arrangements from the library for cornersof the land pattern. FIG. 33 shows a Table 3300 that includes datarelated to the corner arrangements shown in FIGS. 18–32, according to anembodiment of the present invention. The data of Table 3300 could beused to determine total routing channel capacity when incorporatingcorner pad arrangements into land patterns. The information present inTable 3300 is described, column by column, in the following paragraphs:

Columns 3302 and 3304 respectively show X by Y corner arrangement sizes,for each row. For example, a row 3322 of Table 3300 has entries “0” and“4” for columns 3302 and 3304. Thus, row 3322 relates to a“zero-by-four” corner pad arrangement, such as corner arrangement 2500shown in FIG. 25. Column 3316 indicates the example corner arrangementdescribed above that a particular row relates to. For example, for row3322, column 3316 indicates corner arrangement 2500 as an example“zero-by-four” arrangement. Another row 3324 relates to a “two-by-three”corner pad arrangement, such as corner arrangement 1800 shown in FIG.18. Column 3316 indicates that corner arrangement 1800 as an example“two-by-three” arrangement.

Column 3306 shows a number of routing areas present in the respectivecorner arrangement (not including routing areas adjacent to cornerpads), as described above. For example, row 3322 of Table 3300 relatesto corner arrangement 2500 shown in FIG. 25. As shown in FIG. 25, edge1802 of corner arrangement 2500 has zero routing areas between cornerportion 2512 and set 1710 a. Edge 1804 of corner arrangement 2500 hasfour routing areas 2562, 2564, 2566, and 2668 between corner portion2512 and set 1710 b. Thus, corner arrangement 2500 has a total of fourindicated routing areas. The value “4” is indicated in column 3306 forrow 3322. In another example, row 3324 of Table 3300 relates to cornerarrangement 1800 shown in FIG. 18. As shown in FIG. 18, edge 1802 ofcorner arrangement 1800 has two routing areas. Edge 1804 of cornerarrangement 1800 has three routing areas. Thus, corner arrangement 1800has a total of five indicated routing areas, which is indicated incolumn 3306 for row 3324.

Column 3308 shows a number of internal routing channels that areunusable or lost in a respective corner arrangement. For example, row3322 of Table 3300 relates to corner arrangement 2500 shown in FIG. 25.As described above with respect to FIG. 25, corner arrangement 2500 hasone internal routing channel 2576 that is unusable or lost. In theexample of row 3324, corner arrangement 1800 shown in FIG. 18 has nointernal routing channels unusable or lost, as indicated in column 3308.

Column 3310 shows a number of external routing channels that areunusable or lost in a respective corner arrangement. For example, row3322 of Table 3300 relates to corner arrangement 2500 shown in FIG. 25.As described above with respect to FIG. 25, corner arrangement 2500 hastwo external routing channels 2572 and 2574 that are unusable or lost.In the example of row 3324, corner arrangement 1800 shown in FIG. 18 hasno external routing channels unusable or lost, as indicated in column3310.

Column 3312 shows a sum of the internal and external routing channelsthat are unusable or lost for a respective corner arrangement. Forexample, for corner arrangement 2500, row 3322 of Table 3300 shows atotal of three internal and external routing channels that are unusableor lost (i.e., routing channels 2572, 2574, and 2576). In the example ofrow 3324, column 3312 indicates that a total of zero internal andexternal routing channels are unusable or lost for corner arrangement1800.

Column 3314 provides an indication of which corner arrangementssacrifice relatively fewer routing channels. For example, column 3314indicates that corner arrangement 1800 of row 3324 is an optimum cornerarrangement, because it sacrifices zero routing channels.

As described above, column 3316 indicates an example corner arrangementdescribed above to which a particular row relates.

FIG. 34 shows an example flowchart 3400 providing steps for designingland patterns incorporating corner pad arrangements, according toembodiments of the present invention. The steps of FIG. 34 do notnecessarily have to occur in the order shown, as will be apparent topersons skilled in the relevant art(s) based on the teachings herein.Other structural embodiments will be apparent to persons skilled in therelevant art(s) based on the following discussion. These steps aredescribed in detail below.

Flowchart 3400 begins with a step 3402. In step 3402, a number ofrequired pads is determined. For example, the number of required pads istypically a number of pads of an integrated circuit package to bemounted. For example, the number of required pads can be any combinationof power pads, test pads, and signal pads that will interface anintegrated circuit package with the land pattern. Power pads include anypower and ground pads that will interface with power and ground of theintegrated circuit device. Test pads include any pads that willinterface with test signals of the integrated circuit device. Testsignals tend to be used temporarily during test of a particularintegrated circuit package, and are not always made externally availablein a final production version of the integrated circuit package,although in some instances they can remain externally available. Signalpads include any pads for other signals of the integrated circuitpackage. Signal pads tend to be pads that must be routed external to theland pattern on the PCB using routing channels.

In step 3404, a number of required perimeter routing channels isdetermined. The required number of perimeter routing channels is thenumber of pads of the array/land pattern that must be routed externallyfrom the array/land pattern in the PCB with routing channels. Forexample, in an embodiment, the number of required perimeter routingchannels is equal to the number of signal pads, and does not includepower or test pads. In other embodiments, any combination of signal,power, and test pads may require routing channels.

In step 3406, a land pattern is selected to yield the required number ofpads and number of required perimeter routing channels. In anembodiment, step 3406 includes one or more of the steps of flowchart3500, shown in FIG. 35. These steps are described in detail below, andmay occur in any order. Note that these elements of step 3406 can beperformed automatically and/or manually. For example, a user and/or acomputer system can be used to perform any combination of the elementsof step 3502.

In step 3502, a potential land pattern is selected that at least yieldsthe required pads. A land pattern is selected having an array of padswith enough pads for all required signals. For instance, the potentialland pattern can be selected by referring to a table that shows arraysizes and corresponding numbers of pads therein. A number of pads in anarray can alternatively be calculated. For example, a 13×13 array ofconductive pads can be selected as a land pattern. The number of pads ofa 13×13 array/land pattern can be determined from a table, or can becalculated as follows: $\begin{matrix}\begin{matrix}{{{Number}\mspace{14mu}{of}\mspace{14mu}{pads}} = {X\mspace{14mu}{pads}\mspace{14mu}{per}\mspace{14mu}{row} \times}} \\{Y\mspace{14mu}{pads}\mspace{14mu}{per}\mspace{14mu}{column}} \\{= {13 \times 13}} \\{= {169\mspace{14mu}{pads}}}\end{matrix} & {{Equation}\mspace{14mu} 3}\end{matrix}$

The number of routing channels for a 13×13 array/land pattern can bedetermined from a table, or be calculated as follows (First a number ofperimeter pads is determined, followed by a determination of the numberof routing channels): $\begin{matrix}{\begin{matrix}{{Number}\mspace{14mu}{of}} \\{{perimeter}\mspace{14mu}{pads}}\end{matrix} = {\left( {{2 \times X\mspace{14mu}{pads}\mspace{14mu}{per}\mspace{14mu}{row}} - {2\mspace{14mu}{pads}}} \right) +}} & {{Equation}\mspace{14mu} 4} \\{\mspace{205mu}\left( {2 \times Y\mspace{14mu}{pads}\mspace{14mu}{per}\mspace{14mu}{{col}.\;{- 2}}\mspace{14mu}{pads}} \right)} & \; \\{\mspace{169mu}{= {{2 \times X} + {2 \times Y} - 4}}} & \; \\{\mspace{169mu}{= {\left( {X + Y - 2} \right) \times 2}}} & \; \\{\begin{matrix}{{Number}\mspace{14mu}{of}} \\{{routing}\mspace{14mu}{channels}}\end{matrix} = {{Number}\mspace{14mu}{of}\mspace{14mu}{perimeter}\mspace{14mu}{pads} \times 3}} & {{Equation}\mspace{14mu} 5} \\{\mspace{185mu}{= {\left( {\left( {X + Y - 2} \right) \times 2} \right) \times 3}}} & \; \\{\mspace{185mu}{= {\left( {X + Y - 2} \right) \times 6}}} & \; \\{{{For}\mspace{14mu} a\mspace{14mu} 13 \times 13\mspace{14mu}{array}},} & \; \\{\begin{matrix}{{the}\mspace{14mu}{number}\mspace{14mu}{of}} \\{{routing}\mspace{14mu}{channels}}\end{matrix} = {\left( {X + Y - 2} \right) \times 6}} & \; \\{\mspace{185mu}{= {\left( {13 + 13 - 2} \right) \times 6}}} & \; \\{\mspace{185mu}{= {144\mspace{14mu}{routing}\mspace{14mu}{channels}}}} & \;\end{matrix}$

However, if we assume for illustrative purposes that 159 routingchannels are actually required for the example 13×13 array/land pattern,additional routing channels are needed. Thus, the 13×13 array/landpattern can be optimized according to the present invention to provideadditional routing channels, according to the following steps offlowchart 3500.

In step 3504, a pad arrangement is selected for at least one cornerportion of the selected potential land pattern. For example, in anembodiment, any one of the corner pad arrangements described above withrespect to FIGS. 18–32 can be selected as the pad arrangement. A cornerpad arrangement can be selected for any number of corners of theselected potential land pattern, including for all four corners. In theexample of the 13×13 array/land pattern, for illustrative purposes,assume that a 2×3 or 3×2 corner arrangement, as shown in FIG. 18, isselected for all four corners. As described above with respect to FIG.18, a 2×3 or 3×2 corner arrangement has no lost or unusable routingchannels. Thus, if the example 13×13 array/land pattern has four 2×3 or3×2 corner pad arrangements selected, no routing channels are lost dueto the corner pad arrangements. Other selected corner pad arrangementsmay have lost or unusable routing channels. Note that in an exampleembodiment, a lookup key may be used to aid in selecting a corner padarrangement. Such an embodiment is described more fully below withrespect to FIG. 37.

In step 3506, at least one perimeter edge of the selected potential landpattern is under populated in a portion of the at least one perimeteredge outside of the selected pad arrangement for the at least one cornerportion. For example, in embodiments, as described above, any number ofspaces may be positioned in any number of edges of a land pattern toprovide additional routing channels. For example, FIG. 36 shows theperimeter two rows/columns of a 13×13 array/land pattern 3600, accordingto an embodiment of the present invention.

As shown in FIG. 35, 2×3 or 3×2 corner arrangements 1800 are present ineach corner of land pattern 3600, and spaces 402 are positioned in eachof the four perimeter edges to provide additional routing channels. Inthe example of FIG. 36, two spaces 402 are positioned in each edge, fora total of eight spaces. As shown in FIG. 36, one out of every threepads in each edge, between corner pad arrangements 1800, are replacedwith a space 402. For example, as shown in FIG. 36, a pair of sets 1710are positioned in each edge to position spaces 402 in the edges, andprovide additional routing channels. The number of spaces can bedictated by the number of sets 1710 that can be positioned in an edge,between the respective corner pad arrangements. Alternatively, thenumber of spaces positioned in an edge between the respective corner padarrangements can be determined by any of the equations or descriptionpresent elsewhere herein.

In step 3508, it is determined whether the selected potential landpattern yields at least the determined number of required perimeterrouting channels. For example, in an embodiment, the number of perimeterrouting channels present in the selected land pattern is calculated, andthen compared with the required number. For example, the number ofperimeter routing channels present in the example 13×13 array/landpattern, as shown in FIG. 36, can be calculated. $\begin{matrix}\begin{matrix}{{{Number}\mspace{14mu}{of}\mspace{14mu}{routing}\mspace{14mu}{channels}\mspace{14mu}{present}} =} \\{{\begin{matrix}{{number}\mspace{14mu}{of}} \\{{routing}\mspace{14mu}{channels}} \\{previously} \\{present} \\\left( {{e.g.},{{see}\mspace{14mu}{{Eq}.\mspace{14mu} 5}}} \right)\end{matrix} + \begin{matrix}{{number}\mspace{14mu}{of}} \\{{added}\mspace{14mu}{routing}} \\{{channels}\mspace{14mu}{due}} \\{{to}\mspace{14mu}{spaces}\mspace{14mu}(S)} \\\left( {2\mspace{14mu}{channels}\text{/}{space}} \right)\end{matrix} - \begin{matrix}{{number}\mspace{14mu}{of}} \\{{routing}\mspace{14mu}{channels}} \\{{lost}\mspace{14mu}{due}\mspace{14mu}{to}\mspace{14mu}{corner}} \\{{pad}\mspace{14mu}{arrangements}} \\\left( {{e.g.},{{Table}\mspace{14mu} 3300}} \right)\end{matrix}} =} \\{{{\left( {X + Y - 2} \right) \times 6} + {S \times 2} - {\left( {{lost}\mspace{14mu}{channels}} \right) \times \#\mspace{14mu}{corners}}} =} \\{{144 + {8\mspace{14mu}{spaces} \times 2} - {(0) \times 4\mspace{14mu}{corners}}} =} \\{160\mspace{14mu}{routing}\mspace{14mu}{channels}\mspace{14mu}{present}}\end{matrix} & {{Equation}\mspace{14mu} 6}\end{matrix}$

Thus, in the example 13×13 array/land pattern, as modified by thepresent invention, 160 routing channels are present. Thus, assuming that159 routing channels were desired, by comparing the 160 routing channelspresent to the requirement for 159 routing channels, enough routingchannels are present (i.e., one extra routing channel exists).

Note that in an embodiment, if enough routing channels are not presentin the selected potential land pattern after step 3508, steps 3502–3508of flowchart 3500 can be repeated for a subsequently selected array/landpattern size. These steps can be repeated until enough pads and routingchannels are provided by the selected array/land pattern.

Alternatively, steps 3504–3508 can be repeated for the same selectedpotential land pattern, using different corner pad arrangements and/ordifferent numbers of spaces in one or more edges, to determine whetherenough routing channels can be generated.

Note that any one or more of steps 3502, 3504, 3506, and 3508 can beperformed by referring to a Table that lists land pattern sizes, andcorresponding routing channel data for the land patterns after selectingcorner pad arrangements and positioning spaces in edges of the landpatterns. Such tables are further described as follows.

As indicated in column 3312 of FIG. 33, some corner pad arrangementssuffer from greater losses of routing channels than others do. Inembodiments, while any corner pad arrangement can be used with any sizearray/land pattern (assuming that the array/land pattern is large enoughfor a corner pad arrangement), corner pad arrangements with fewerrouting channels lost or unusable are preferable. A Table 3700 shown inFIG. 37 shows an example selection of corner pad arrangements used forparticular array/land pattern sizes, according to an embodiment of thepresent invention. Furthermore, as described below, Table 3700 of FIG.37 can be applied to array/land pattern sizes not directly shown inTable 3700. The information present in Table 3700 of FIG. 37 isdescribed, column by column, in the following paragraphs:

Column 3702 shows a key for each row that can be used as a reference fora particular set of corner arrangements corresponding to that row.

Column 3704 shows an offset key for each row.

Columns 3706 and 3708 respectively show a count of pads or pins in a row(X) and a count of pads or pins in a column (Y) of the land pattern orarray of that particular row of Table 3700. For example, row 3758 refersto a 13×13 array/land pattern, as indicated in columns 3706 and 3708.

Columns 3710 and 3712 respectively show a count of pads or pins in a row(X) and a count of pads or pins in a column (Y) of the land patternafter spaces are removed from edges of the land pattern. In column 3710,“NS” refers to “North” and “South” edges, and in column 3712, “EW”refers to “East” and “West” edges of the land pattern. For example, forthe 13×13 array/land pattern of FIG. 36, these edges are indicated with“N”, “S”, “E”, and “W” symbols. Note that these indicated directions arerelative, and that the present invention relates to land patternsrotated or mirrored in any orientation.

Columns 3714, 3716, 3718, and 3720 respectively show corner padarrangements selected for northeast, southeast, southwest, and northwestcorners of the respective land pattern. For example, row 3758 indicatesthat a 3×2 corner arrangement was selected for all four corners for a13×13 array/land pattern. An example 3×2 corner arrangement wasdescribed above with respect to FIG. 18.

Columns 3722, 3724, 3726, and 3728 respectively indicate a number ofinternal routing channels lost for each of the northeast, southeast,southwest, and northwest corner pad arrangements indicated in columns3714, 3716, 3718, and 3720. For example, these columns of row 3758indicate that no internal routing channels were lost for the 3×2 cornerarrangements selected for all four corners. The loss of no internalrouting channels was indicated above with respect to the example 3×2corner arrangement described above with respect to FIG. 18.

Column 3730 indicates a total number of internal routing channels lost,as indicated in columns 3722, 3724, 3726, and 3728. For example, row3758 indicates a total of zero internal routing channels lost.

Columns 3732, 3734, 3736, and 3738 respectively indicate a number ofexternal routing channels lost for each of the northeast, southeast,southwest, and northwest corner pad arrangements indicated in columns3714, 3716, 3718, and 3720. For example, these columns of row 3758indicate that no external routing channels were lost for the 3×2 cornerarrangements selected for all four corners. The loss of no externalrouting channels was indicated above with respect to the example 3×2corner arrangement described above with respect to FIG. 18.

Column 3740 indicates a total number of external routing channels lost,as indicated in columns 3732, 3734, 3736, and 3738. For example, row3758 indicates a total of zero external routing channels lost.

Column 3742 indicates a total of all routing channels lost, which is asummation of columns 3730 and 3740. For example, row 3758 indicates atotal of zero routing channels lost.

Column 3744 refers to figures that show example land patterns reflectingthe corner pad arrangements and any routing channels lost as shown inthe corresponding row. For example, row 3758 corresponds to 13×13array/land pattern, such as land pattern 3600 shown in FIG. 36. Landpattern 3600 includes a 3×2 corner pad arrangement 1800 in each corner,which suffer no lost routing channels. Example arrays/land patternscorresponding to the remaining rows of column 3744 are described asfollows with regard to FIGS. 38–42 as follows. For illustrativepurposes, only the outer two perimeter rows/columns of the arrays/landpatterns of FIGS. 38–42 are shown. As will be described below, theconfiguration of land patterns of FIGS. 36 and 38–42 can be extended toland patterns of any size.

FIG. 38 shows an example 13×14 array/land pattern 3800, according to anembodiment of the present invention. Land pattern 3800 corresponds torows 3760 and 3764 of Table 3700 shown in FIG. 37. As shown in FIG. 38,land pattern 3800 has a 3×3 corner arrangement 2000 (of FIG. 20) in thenorthwest and southeast corners, and has a 2×3 corner arrangement 1800in the northeast and southwest corners. As indicated in column 3742, atotal number of only two routing channels are lost due to the corner padarrangements selected. Two spaces 402 are present in each edge of landpattern 3800.

FIG. 39 shows an example 14×14 array/land pattern 3900, according to anembodiment of the present invention. Land pattern 3900 corresponds torow 3766 of Table 3700 shown in FIG. 37. As shown in FIG. 39, landpattern 3900 has a 3×3 corner arrangement 2000 (of FIG. 20) in allcorners. As indicated in column 3742, a total number of only fourrouting channels are lost due to the corner pad arrangements selected.Two spaces 402 are present in each edge of land pattern 3900.

FIG. 40 shows an example 14×15 array/land pattern 4000, according to anembodiment of the present invention. Land pattern 4000 corresponds torows 3754 and 3762 of Table 3700 shown in FIG. 37. As shown in FIG. 40,land pattern 4000 has a 3×2 or 2×3 corner arrangement 1800 (of FIG. 18)in all corners. As indicated in column 3742, a total number of zerorouting channels are lost due to the corner pad arrangements. Two spaces402 are present in each of the North and South edges, and three spaces402 are present in each of the East and West edges of land pattern 4000.

FIG. 41 shows an example 15×15 array/land pattern 4100, according to anembodiment of the present invention. Land pattern 4100 corresponds torow 3750 of Table 3700 shown in FIG. 37. As shown in FIG. 41, landpattern 4100 has a 2×3 corner arrangement 1800 (of FIG. 18) in each ofthe northeast and southwest corners, and a 2×4 corner arrangement 1900(of FIG. 19) in each of the northwest and southeast corners. Asindicated in column 3742, a total number of only two routing channelsare lost due to the corner pad arrangements selected. Three spaces 402are present in each of the edges of land pattern 4100.

FIG. 42 shows an example 15×16 array/land pattern 4200, according to anembodiment of the present invention. Land pattern 4200 corresponds torows 3752 and 3756 of Table 3700 shown in FIG. 37. As shown in FIG. 42,land pattern 4200 has a 3×2 or 2×3 corner arrangement 1800 (of FIG. 18)in the northwest, northeast, and southeast corners, and a 2×4 cornerarrangement 1900 (of FIG. 19) in the southwest corner. As indicated incolumn 3742, a total number of only one routing channel is lost due tothe corner pad arrangements selected. Three spaces 402 are present ineach of the North, East, and West edges, and two spaces 402 are presentin the South edge of land pattern 4200.

The configurations of the land patterns of FIGS. 36 and 38–42 can beextended to configure land patterns of any size that have similarcharacteristics. For example, by changing a length of a row and/or acolumn of a land pattern of one of FIGS. 36 and 38–42, another size landpattern can be created, having similar routing channel characteristicsto the original land pattern. Adding a multiple of three rows and/orthree columns to one of the land patterns of FIGS. 36 and 38–42 cancreate any size land pattern. The land pattern thus created will havethe same corner pad arrangements as the original land pattern of FIGS.36 and 38–42. Furthermore, by adding in multiples of three, thelengthened row/column will have a/an additional set(s) 1710 positionedtherein, each having a space 402 that adds a known number of routingchannels.

For example, assume that a 22×23 array/pattern is desired. The 22×23array/land pattern can be created by enlarging one of the land patternsof FIGS. 36 and 38–42. A land pattern of FIGS. 36 and 38–42 is enlargedby multiples of three of rows and columns. The 13 by 14 array/landpattern of FIG. 38 is suitable for creating the 22×23 array/landpattern. This is because:22 rows=13 rows+3×(3 rows)23 columns=14 columns+3×(3 columns)

As shown above, a 22×23 array/land pattern is based upon a 13×14array/land pattern, after adding multiples of 3 rows and 3 columnsthereto. Thus, row 3760 of Table 3700 shown in FIG. 37 can be referredto when creating a 22×23 array/land pattern. Corner pad arrangements forthe 22×23 array/land pattern can be obtained (i.e., see columns 3714,3716, 3718, and 3720), and lost routing channel information can beobtained (i.e., see column 3742). Furthermore, three sets 1710 are addedto each edge to create additional routing channels.

Another way to determine the particular array/land pattern in Table 3700on which to base a desired land pattern size upon is to generate alookup key, which can be used to reference column 3702. The lookup keycan be generated from a land pattern by concatenating a remainder of thenumber of rows divided by 3, to a remainder of the number of columnsdivided by three, as shown in Equation 7 below: $\begin{matrix}\begin{matrix}{{{Lookup}\mspace{14mu}{key}} = {{remainder}\mspace{14mu}{of}\mspace{40mu}{concatenate}\mspace{25mu}{remainder}\mspace{14mu}{of}}} \\{\left( {\left( {\#\mspace{14mu}{of}\mspace{14mu}{rows}} \right)/3} \right)\mspace{135mu}\left( {\left( {\#\mspace{14mu}{of}\mspace{14mu}{columns}} \right)/3} \right)}\end{matrix} & {{Equation}\mspace{14mu} 7}\end{matrix}$Thus, using the 22×23 array/land pattern example, the lookup key wouldbe: $\begin{matrix}{{{Look}\mspace{14mu}{up}\mspace{14mu}{key}} = {{remainder}\mspace{14mu}{of}\mspace{14mu}\left( {22/3} \right)\mspace{14mu}{concatenate}\mspace{14mu}{remainder}\mspace{14mu}{of}\mspace{14mu}\left( {23/3} \right)}} \\{= {1\mspace{14mu}{concatenate}\mspace{14mu} 2}} \\{= 12}\end{matrix}$Column 3702 can then be referred to for the lookup key of “12,” whichappears in row 3760. Thus, again, the 22×23 array/land pattern can bebased on the 13×14 array/land pattern of column 3760, an example ofwhich is shown in FIG. 38. Other corner pad arrangements may beappropriate in some situations, although, in some embodiments, thecorner pad arrangements shown are optimum.

Thus, in the manner described above, any size array/land pattern can becreated from the array/land patterns of FIGS. 36 and 38–42. A Table 4300is shown in FIGS. 43A and 43B, that is similar to Table 600 shown inFIGS. 6A and 6B, according to an embodiment of the present invention.Table 4300 contains information directed to numerous sizes of ICpackages and land patterns that incorporate the corner pad arrangementsshown in Table 3700 of FIG. 37. Thus, Table 4300 can be referred to whenselecting/designing an array/land pattern that incorporates these cornerpad arrangements. Table 4300 can be referred to by a user, manually, orcan be incorporated in an automatic system. The columns of Table 4300that are not included in Table 600 of FIGS. 6A and 6B are described inthe following paragraphs:

Column 4302 shows a lookup key for each row that can be used todetermine corner pad arrangements for the array/land pattern of thatrow. For example, the lookup key can be used to refer to column 3702 ofTable 3700, shown in FIG. 37. The lookup key corresponds to theparticular row of Table 3700 that contains the corner pad arrangements(i.e., columns 3714, 3716, 3718, and 3720) used for the array/landpattern. For example, row 4360 in Table 4300 corresponds to row 660 ofTable 600 shown in FIG. 6A (i.e,. corresponds to a 19×19 array/landpattern). As shown in FIG. 43A, column 4302 indicates a lookup value of11 for row 4360. Referring to column 3702 of Table 3700, the lookupvalue of 11 is in row 3758, which corresponds to a 13×13 array/landpattern, an example of which is shown in FIG. 36.

Column 4304 shows the number of pads remaining in each of the North andSouth edges of the array/land pattern, after removal of peripheral padsor pins according to the present invention (i.e., replacing pads withspaces in the edges). For example, for row 4360, a 15 is entered incolumn 4304, indicating that 15 pads remain in the North and South edgesof the array/land pattern. In other words, 19−15=4 spaces are present inthese edges.

Column 4306 shows the number of pads remaining in each of the East andWest edges of the array/land pattern, after removal of peripheral padsor pins according to the present invention (i.e., replacing pads withspaces in the edges). For example, for row 4360, a 15 is entered incolumn 4306, indicating that 15 pads remain in the East and West edgesof the array/land pattern. In other words, 19−15=4 spaces are present inthese edges.

Column 4308 shows, for each row of Table 4300, a resulting total numberof pads or pins remaining for the entire array/land pattern, afterremoval of peripheral pads or pins according to the present invention.For example, for row 4360, a number of 345 remaining pads is entered incolumn 4306. A value in column 4306 may be calculated as follows:$\begin{matrix}{{{Value}\mspace{14mu}{in}}\mspace{50mu} = {{{value}\mspace{14mu}{in}}\mspace{45mu} - {2 \times \left( {{\#\mspace{14mu}{of}\mspace{14mu}{spaces}} + {\#\mspace{14mu}{of}\mspace{14mu}{spaces}}} \right)}}} \\\left. {{column}\mspace{14mu} 4308{\mspace{31mu}}{column}\mspace{14mu} 608\mspace{79mu}{in}\mspace{14mu}{NS}\mspace{14mu}{rows}\mspace{40mu}{in}\mspace{14mu}{EW}\mspace{14mu}{rows}} \right) \\{= {361 - {2 \times \left( {4 + 4} \right)}}} \\{= 345}\end{matrix}$Note that the number of spaces in NS and EW rows can be calculated asfollows: $\begin{matrix}{\#\mspace{14mu}{of}\mspace{14mu}{spaces}} & = & {{value}\mspace{14mu}{in}} & - & {{value}\mspace{14mu}{in}} \\{{in}\mspace{14mu}{NS}\mspace{14mu}{rows}} & \; & {{column}\mspace{14mu} 604} & \; & {{column}\mspace{14mu} 4304} \\{\#\mspace{14mu}{of}\mspace{14mu}{spaces}} & = & {{value}\mspace{14mu}{in}} & - & {{value}\mspace{14mu}{in}} \\{{in}\mspace{14mu}{EW}\mspace{14mu}{rows}} & \; & {{column}\mspace{14mu} 606} & \; & {{column}\mspace{14mu} 4306}\end{matrix}$

Column 4310 shows a total number of externally available pads or pinsfor the entire land pattern or array after removal of pads or pinsaccording to the present invention, and using the particular corner padarrangements indicated in Table 3700 for the particular array/landpattern. For example, the value for column 4310 for a particular row canbe calculated using Equation 6 described above. For example, for row4360, the value in column 4306 (i.e., 248) can be calculated as follows:$\begin{matrix}{= \text{number~~of~~routing~~channels~~previously~~present~~(e.g.,~~value}} \\{\text{in~~column~~610)} + \text{number~~of~~added~~routing~~channels~~due}} \\{\text{to~~spaces}\mspace{14mu}\left( {{2 \times \#\mspace{14mu}\text{of~~spaces)}} - \text{number~~of~~routing~~channels}} \right.} \\{\text{lost~~due~~to~~corner~~pad~~arrangements~~(e.g.,~~Table~~3700)}} \\{= {216 + {2 \times 2 \times \left( {4 + 4} \right)} - 0}} \\{= 248}\end{matrix}$

Column 4312 shows a total number of internal or “orphaned”, unavailablepads or pins for the entire land pattern or array after removal of padsor pins according to the present invention, and using the particularcorner pad arrangements indicated in Table 3700 for the particulararray/land pattern. For example, the value for column 4312 for aparticular row can be calculated as:Value in column 4312=value in column 4308−value in column 4310For row 4360, the value for column 4312 is calculated as:=345−248=97

Column 4314 shows a percentage of pads or pins that are internal ororphaned for the entire land pattern or array after removal of pads orpins according to the present invention, and using the particular cornerpad arrangements indicated in Table 3700 for the particular array/landpattern. Thus, for each row, a value in column 4314 may be calculated asfollows:$\text{value~~in~~column~~4314} = {\frac{\text{value~~in~~column~~4312}}{\text{value~~in~~column~~4310}} \times 100}$For row 4360, the value for column 4314 is calculated as:${\frac{97}{248} \times 100} = {28\%}$

Thus, note that as compared to row 660 of FIG. 6A, column 626 of Table600, row 4360, column 4314 indicates an equal percentage. Table 600 ofFIGS. 6A and 6B does not take into account corner pad arrangements, thusproviding an approximation. If corner arrangements are used that havelost or unused routing channels, a value in column 4360 may have ahigher percentage of internal or orphaned pads or pins when compared toa corresponding value in column 660 (i.e., where corner arrangements areconsidered to lose no routing channels).

In a further embodiment, power and/or ground may be taken into accountwhen selecting corner pad arrangements. The number and location ofrouting channels for power and/or ground in a land pattern/array can befactored in when making this determination. This has a benefit whendesigning PCBs. For example, PCBs may be designed in variousconfigurations, including: (a) having power and ground on multiplelayers separate from other signals; (b) having power and ground routedon a bottom layer of a PCB, while signals are routed on a top layer ofthe PCB; (c) having power and other signals routed on the top layerwhile ground is routed on the bottom layer; and (d) having power,ground, and other signals all routed on the top layer (i.e., a singlelayer) of the PCB. Although (c) and (d) tend to be the most difficultconfigurations to design, the present invention provides for design ofall these configurations.

For example, FIG. 45 shows a Table 4500 that provides informationrelating corner pad arrangements to power/ground channel distribution,according an embodiment of the present invention. Table 4500 is based ona design parameter where power/ground routing channels use an areaequivalent to two signal routing channels, although in alternativeembodiments, power/ground can use other numbers of signal routingchannels. (Thus, in alternative embodiments, the contents/results ofTable 4500 can be calculated with or without reference to Table 4500.)Table 4500 of FIG. 45 includes some columns similar to those of Table 37of FIG. 37, which are numbered correspondingly.

Column pairs 4502, 4504, 4506, 4508, 4510, 4512, 4514, 4516, and 4518 ofTable 4500 relate to different power/ground routing channel quantitiesin edges of land pattern/arrays. For each column pair, row 4520indicates a number of power/ground in North and South (NS) and in Eastand West (EW) edges of a land/pattern array, as indicated by columnslabeled NS and EW for each column pair. For example, column pair 4502indicates zero power or ground channels in both of the NS and EW edgesof a respective land pattern/array. In another example, column pair 4512indicates one power or ground channel in each of the NS edges, and twopower/ground channels in each of the EW edges of a respective landpattern/array.

In an embodiment, Table 4500 can be used to select a set of corner padarrangements from the array/land patterns of FIGS. 36 and 38–42 for aparticular land pattern/array having a particular configuration ofpower/ground channels. For example, for illustrative purposes, assume a15×15 land pattern/array is desired, having two power channels in eachof the North and South edges, and one power channel in each of the Eastand West edges. Column 4516 is thus referred to, as it corresponds tothe two NS power/ground channels and one EW power/ground channel, asshown in row 4520. Row 4532 of column 4516 indicates “15” for NS edgesand “15” for EW edges, and thus corresponds to the example, desired15×15 land pattern/array. As shown for row 4532, in column 3702, alookup key value of “12” is appropriate for the 15×15 landpattern/array, having the example power constraints. Furthermore, asindicated in column 3744 for row 4532, an appropriate set of corner padarrangements for the example 15×15 land pattern/array is provided inFIG. 38, which shows 13×14 array/land pattern 3800. Thus, in the presentexample, the corner pad arrangements for 13×14 pad/pin landpattern/array 3800 of FIG. 38 can used for a 15×15 land pattern/arraythat requires two power channels in each of the North and South edges,and one power in each of the East and West edges. As shown in FIG. 38,two corners of 13×14 pad/pin land pattern/array 3800 use 2×3 corner padarrangement 1800, and two corners use 3×3 corner pad arrangement 2000.These arrangement can be selected to design the corners of the example15×15 land pattern/array. This process can be used for any sized landpattern/array, having any number of required power(s) and/or ground(s).

Although the largest number of powers/grounds shown in row 4520 for aparticular NS or EW column is two, the information in column pairs 4502,4504, 4506, 4508, 4510, 4512, 4514, 4516, and 4518 can be extended tonumbers greater than two. Each entry in these columns extends to thevalue located therein, plus three multiplied by any integer:$\begin{matrix}\begin{matrix}\begin{matrix}\begin{matrix}\text{An~~entry~~in~~a} \\{{NS}\mspace{14mu}{or}\mspace{14mu}{EW}}\end{matrix} \\\text{column~~covers}\end{matrix} \\\text{a~~number~~of}\end{matrix} \\\text{powers}\end{matrix} = {\begin{matrix}\begin{matrix}\begin{matrix}\text{value~~of~~entry} \\\text{in~~respective}\end{matrix} \\{{NS}\mspace{14mu}{or}\mspace{14mu}{EW}}\end{matrix} \\\text{column}\end{matrix} + {3 \times N}}$where N=any integer greater than or equal to zero

For example, column pair 4506 has an entry of 0 in the NS column, and anentry of 2 in the EW column (i.e., 0, 2). Thus, according to the aboveequation, the NS and EW entries of column pair 4506 also coverpower/ground numbers of: 0, 5 (0+3×0,2+3×1); 3,2 (0+3×1,2+3×0); and 6, 8(0+3×2, 2+3×2), for example. Thus, column pair 4506 can be consultedwhen designing land pattern/arrays having these required number ofpower/ground traces.

Thus, corner pad arrangements corresponding to various landpattern/array sizes can be calculated, or can be determined using Table4500. Use of Table 4500 in this manner enables the multi- andsingle-layer routing configurations described above. Note that inalternative embodiments, corner pad arrangements other than thosedetermined using Table 4500 can be used for particular landpattern/arrays.

Thus, in any of the manners describe above, arrays/land patterns canhave selected corner pad arrangements to aid in signal routing. Asdescribed above, any corner pad arrangement can be used with anyarray/land pattern size, pursuant to the particular application.Furthermore, note that selected corner arrangements can be used in thesingle- and multi-layer embodiments of the present invention describedabove.

For example, FIGS. 44A–44C illustrate a multi-layer embodiment of thepresent invention, present in a printed circuit board. FIG. 44A shows afirst layer of a PCB that has conductive features including a 25×25 landpattern 4400 and associated routing. FIG. 44B shows a second layer ofthe PCB that has conductive features including an 18×18 array 4450 ofconductive vias/pads and associated routing. FIG. 44C shows the views ofland pattern 4400 and array 4450 overlaid on each other. Althoughspecific ball pitch, pad size, via size, trace width, and other sizerelated data is shown in FIGS. 44A–44C, this data is provided forillustrative purposes, and is not limiting.

Land pattern 4400 of FIG. 44A is configured to mount an integratedcircuit device, such as a ball grid array package. A plurality ofconductive vias 4402 through the printed circuit board electricallycouple a portion of the conductive pads 4404 of land pattern 4400 tocorresponding conductive vias/pads 4452 of via array 4450 of the secondlayer.

As shown in FIGS. 44A and 44B, corner arrangements have been selectedfor land pattern 4400 and via array 4450. For each corner of landpattern 4400, a 2×3 corner arrangement 1800 has been selected. For eachcorner of via array 4450, a 1×1 corner arrangement 2600 has beenselected. As described above with respect to FIG. 18, the 2×3 cornerarrangements 1800 of land pattern 4400 suffer no lost or unusablerouting channels. As described above with respect to FIG. 26, the 1×1corner arrangements 2600 of via array 4450 each suffer from three lostor unusable routing channels 2672, 2674, and 2676. These lost orunusable routing channels are represented in FIG. 44B by missing routingchannels in each corner of via array 4450.

Furthermore, as shown in FIGS. 44A and 44B, each perimeter edge of landpattern 4400 and via array 4450 is not fully populated with conductivevias/pads. Spaces 402 are created in each edge to create additionalrouting channels for signals from conductive pads within land pattern4400 and via array 4450 to be routed external through the respectiveedges. In an embodiment, as shown in FIG. 44B, due to the positions ofvias 4452 relative to pads 4404 in FIG. 44A, it appears that channels ofspaces 4490 are formed through via array 4450. In other words, aNorth-South and East-West gap is formed through via array 4450. Thesegaps or channels of spaces 4490 can be used to supply additional routingchannels, as shown in FIG. 44B.

Note that as shown in the example of FIGS. 44A and 44B, that allconductive pads of the ten most peripheral rows/columns of land pattern4400 were successfully externally routed on one of the two layers. Thus,it is noted that in certain applications, such as field programmablegate array (FPGA) applications where internal/orphaned power/ground/testpins are not necessary, such a configuration can be very beneficial. Asa result, a 20×20 integrated circuit package size can be formed that canhave every pad/pin externally routed in the land pattern. In otherwords, for each side of the land pattern, 10 rows/columns can becompletely routed, so that a 20×20 array size can be completely routed.Taking this further, integrated circuit packages can be designed having20 pads/pins along one dimension (row or column), and having any lengthin pads/pins along the other dimension, where the entire integratedcircuit package can still be completely routed. For example, such anintegrated circuit package could have sizes such as 20×20, 20×30, 20×40,and any other 20×N size, and can have all pads/pins routed externally.

CONCLUSION

Thus, a user and/or computer system can use the above describedprocesses, equations, and/or tables to design arrays/land patterns andvia arrangements, according to the various embodiments of presentinvention. Thus, the present invention is applicable to any type ofapparatus or system, manual or automatic, including being stored on acomputer program product such as a computer storage device (e.g., harddrive, hard disc, floppy disc, CDROM, etc.). The present invention canbe implemented in hardware, software, firmware, and any combinationthereof.

While various embodiments of the present invention have been describedabove, it should be understood that they have been presented by way ofexample only, and not limitation. For example, in an embodiment, asecond non-fully populated row or column of pads/pins may be placedadjacent to a first non-fully populated edge row or column of pads/pinsto provide even more routing channels. Furthermore, the presentinvention allows for standard and for non-standard ball pitch distancesin the peripheral rows and columns of pads/pins. It will be apparent topersons skilled in the relevant art(s) that various changes in form anddetail can be made therein without departing from the spirit and scopeof the invention. Thus, the breadth and scope of the present inventionshould not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

1. A ball grid array land pattern comprising: a plurality of conductivepads arranged in an array of rows and columns, wherein at least one edgeof a perimeter of said array is not fully populated with conductivepads, whereby spaces created in said at least one edge by missingconductive pads create additional routing channels for signals fromconductive pads within said array to be routed external to said arraythrough said at least one edge, wherein a ratio of conductive pads insaid at least one edge to a number of said spaces in said at least oneedge is at least two to one (2:1).
 2. The land pattern of claim 1,wherein said at least one edge includes a plurality of serially alignedconductive pads having a space therebetween, wherein said space allowsfor at least one additional routing channel than when said at least oneedge is fully populated.
 3. The land pattern of claim 2, wherein saidspace allows for two additional routing channels than when said at leastone edge is fully populated.
 4. The land pattern of claim 1, whereinsaid at least one edge includes a plurality of serially alignedconductive pads having spaces therebetween created by missing pads,wherein said spaces create additional routing channels for signals fromsaid conductive pads within said array to be routed external to saidarray through said at least one edge.
 5. The land pattern of claim 4,wherein a higher proportion of said plurality of conductive pads areaccessible by routing channels on a common layer with said conductivepads than when said at least one edge of said array is fully populatedwith pads.
 6. The land pattern of claim 4, wherein said array has ahigher ratio of conductive pads that are externally routable on a singlelayer of said substrate material to conductive pads that are notexternally routable on the single layer than when said at least one edgeof said array is fully populated with pads.
 7. The land pattern of claim1, wherein said at least one edge comprises a first conductive pad and asecond conductive pad separated by a space due to a missing conductivepad, the land pattern further comprising seven conductive routingchannels routed between the first conductive pad and the secondconductive pad from said conductive pads within said array external tosaid array.
 8. The land pattern of claim 1, wherein a row or column ofsaid array parallel and adjacent to said at least one edge issubstantially fully populated with conductive pads.
 9. The land patternof claim 8, wherein said at least one edge includes a repeating patternof a first conductive pad, a space, and a second conductive pad,positioned in series.
 10. A ball grid array land pattern comprising: aplurality of conductive pads arranged in an array of rows and columns,wherein at least one edge of a perimeter of said array is not fullypopulated with conductive pads, whereby spaces created in said at leastone edge by missing conductive pads create additional routing channelsfor signals from conductive pads within said array to be routed externalto said array through said at least one edge; wherein a number of saidspaces is equal to S, whereS=INT((E−5)/3), where: E=a number of conductive pads in said at leastone edge, if fully populated; and INT is an INTEGER function, roundeddown.
 11. A land pattern comprising: a plurality of conductive padsarranged in an array of rows and columns, wherein an edge of a perimeterof said array is not fully populated with conductive pads, wherebyspaces created in said edge by missing conductive pads create additionalrouting channels for signals from conductive pads within said array tobe routed external to said array through said edge; wherein a ratio ofconductive pads in said edge to a number of said spaces in said edge isat least two to one (2:1).
 12. The land pattern of claim 11, whereinsaid edge includes a plurality of serially aligned conductive padshaving a space therebetween, wherein said space allows for at least oneadditional routing channel than when said edge is fully populated. 13.The land pattern of claim 12, wherein said space allows for twoadditional routing channels than when said edge is fully populated. 14.The land pattern of claim 11, wherein said edge includes a plurality ofserially aligned conductive pads having spaces therebetween created bymissing pads, wherein said spaces create additional routing channels forsignals from said conductive pads within said array to be routedexternal to said array through said edge.
 15. The land pattern of claim14, wherein a higher proportion of said plurality of conductive pads areaccessible by routing channels on a common layer with said conductivepads than when said edge of said array is fully populated with pads. 16.The land pattern of claim 14, wherein said array has a higher ratio ofconductive pads that are externally routable on a single layer of saidsubstrate material to conductive pads that are not externally routableon the single layer than when said edge of said array is fully populatedwith pads.
 17. The land pattern of claim 11, wherein said edge comprisesa first conductive pad and a second conductive pad separated by a spacedue to a missing conductive pad, the land pattern further comprisingseven conductive routing channels routed between the first conductivepad and the second conductive pad from said conductive pads within saidarray external to said array.
 18. The land pattern of claim 11, whereina row or column of said array parallel and adjacent to said edge issubstantially fully populated with conductive pads.
 19. The land patternof claim 18, wherein said edge includes a repeating pattern of a firstconductive pad, a space, and a second conductive pad, positioned inseries.
 20. A land pattern, comprising: a plurality of conductive padsarranged in an array of rows and columns, wherein an edge of a perimeterof said array is not fully populated with conductive pads, wherebyspaces created in said edge by missing conductive pads create additionalrouting channels for signals from conductive pads within said array tobe routed external to said array through said edge, wherein a number ofsaid spaces is equal to S, whereS=INT((E−5)/3), where: E=a number of conductive pads in said edge, iffully populated; and INT is an INTEGER function, rounded down.